NDLI: Fabrication and characterization of electrospun composite materials

Content Provider	IEEE Xplore Digital Library
Author	Shanshan Bian Jayaram, S.H. Cherney, E.A.
Copyright Year	2012
Description	Author affiliation: Department of Electrical and Computer Engineering, University of Waterloo, 200 University Avenue West, ON, CA N2L 3G1 (Shanshan Bian; Jayaram, S.H.; Cherney, E.A.)
Abstract	In this work, the characteristics of silicone rubber (SiR) and epoxy composites prepared by using the electrospinning technique are compared with conventionally prepared composite materials. Both micron sized silica fillers and silica/aluminum nanofillers are used in preparing the composites. The technique of electrospinning was used to enhance the dispersion of nanofillers by embedding the fillers in the polymer. The thermo-gravimetric analysis(TGA) of the composites has shown that the interfacial bonding between the fillers and the polymer matrix is strong in those samples prepared using the ES technique, which agrees with the uniform filler morphology observed in the SEM images. Further, it has been shown that heat resistance, tensile strength, and elongation at break for electrospun SiR samples are better than those for conventionally prepared samples. Similarly, for epoxy composites prepared using ES technique, a significant improvement in thermal properties have been obtained.
Starting Page	1
Ending Page	4
File Size	919693
Page Count	4
File Format	PDF
ISBN	9781467328524
ISSN	21609241
e-ISBN	9781467328517
DOI	10.1109/ICPADM.2012.6318914
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-07-24
Publisher Place	India
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon compounds Thermal resistance Polymers Epoxy resins Cooling thermal conductivity Electrospinning composites fillers heat resistance TGA
Content Type	Text
Resource Type	Article

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