NDLI: Measurement and 3D simulations of substrate noise isolation and resistance for mixed signal applications

Content Provider	IEEE Xplore Digital Library
Author	Rajendran, K. Johnson, J.B. Furkay, S. Kumar, M. Fischer, S.
Copyright Year	2004
Description	Author affiliation: IBM Syst. & Technol. Group, Essex Junction, VT, USA (Rajendran, K.; Johnson, J.B.; Furkay, S.; Kumar, M.)
Abstract	In this work an enhanced approach to 3D process modeling using mixed element meshes followed by tetrahedralization and small signal device simulation by Fielday is presented. This methodology is then used to analyze and predict the effects of various substrate isolation schemes on substrate noise coupling. Experimental results are used to calibrate and verify the simulation results. Our proposed various substrate isolation test structure results reveal that layout guidelines and isolation parameter analysis are useful in signal isolation optimization.
Sponsorship	IEEE Microwave Theory and Techniques Soc. Georgia Electron. Design Center at Georgia Tech. NASA Glenn Res. Center
Starting Page	99
Ending Page	102
File Size	564116
Page Count	4
File Format	PDF
ISBN	0780387031
DOI	10.1109/SMIC.2004.1398177
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-09-08
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electrical resistance measurement Noise measurement Circuit noise Isolation technology Coupling circuits Circuit simulation Digital circuits Signal processing Testing Radio frequency
Content Type	Text
Resource Type	Article

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