NDLI: Improvement of CMOS-MEMS accelerometer using the symmetric layers stacking design

Content Provider	IEEE Xplore Digital Library
Author	Ting-Han Yen Ming-Han Tsai Chun-I Chang Yu-Chia Liu Sheng-Shian Li Rongshun Chen Jin-Chern Chiou Weileun Fang
Copyright Year	2011
Description	Author affiliation: Electrical Control Engineering Institute, National Chiao Tung Univ., Hsinchu, Taiwan (Jin-Chern Chiou) \|\| NanoEngineering and MicroSystems Institute, National Tsing Hua Univ., Hsinchu, Taiwan (Ming-Han Tsai; Chun-I Chang; Yu-Chia Liu) \|\| Power Mech. Eng. Dept., National Tsing Hua Univ., Hsinchu, Taiwan (Ting-Han Yen; Sheng-Shian Li; Rongshun Chen; Weileun Fang)
Abstract	This study presents a novel CMOS-MEMS capacitive type accelerometer design which consists of symmetric layers (4 metal and 3 dielectric layers) stacking to reduce the bending of suspended structures due to thin film residual stresses. Thus, the capacitance loss caused by the mismatch of sensing electrodes is reduced. Moreover, structures with symmetric layers stacking have less thermal deformation by temperature variation. A simple post-CMOS process including oxide wet-etching and dry XeF etching is established to fabricate the device. Measurement shows maximum bending deformation of a suspended 390µm×430µm structure is only 1µm, and mismatch of fixed and movable sensing electrodes is reduced to 1µm. The bending curvature has only ∼2% change as temperature increased 80°C. The sensitivity of this accelerometer is 1.46mV/G (in comparison, the accelerometer with asymmetric layers stacking structure has sensitivity of 0.07mV/G), and the noise level is 0.35mG/√Hz.
Starting Page	145
Ending Page	148
File Size	1375866
Page Count	4
File Format	PDF
ISBN	9781424492909
ISSN	19300395
e-ISBN	9781424492893
DOI	10.1109/ICSENS.2011.6127150
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-10-28
Publisher Place	Ireland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Accelerometers Stacking Etching Electrodes Temperature measurement Residual stresses Sensors
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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