NDLI: Performance characterization of pressure sensitive adhesive thermal interface materials

Content Provider	IEEE Xplore Digital Library
Author	Chu, H. Selvakumar, A.
Copyright Year	2009
Description	Author affiliation: Cisco Systems, Inc., San Jose, CA, USA (Chu, H.; Selvakumar, A.)
Abstract	An issue often raised by engineers regarding thermal interface materials (TIM) is that vendor data do not match the results obtained from actual applications. Typical reasons for these issues may be vendor variations in testing, such as variances in test procedure and setup. This study compares vendor data from various vendors with results obtained from both realistic and ideal test conditions under consistent test method and uniform test conditions, in order to eliminate any inconsistencies in testing. This current work examines the performance of thermal pressure sensitive adhesive (PSA) TIMs, and compares the thermal performance of various materials from several vendors. For comparison to vendor data, testing is performed for flat and non-flat surfaces to examine the differences under ideal condition to that of more realistic in actual applications. The test process, results and observations are discussed.
Starting Page	299
Ending Page	303
File Size	436684
Page Count	5
File Format	PDF
ISBN	9781424436644
ISSN	10652221
e-ISBN	9781424436651
DOI	10.1109/STHERM.2009.4810779
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-03-15
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Testing Heat transfer Heat sinks Conducting materials Thermal conductivity Thermal loading Equations Data engineering Thermal engineering Cooling TIM Pressure sensitive adhesive thermal interface material PSA
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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