NDLI: Experimental techniques for thermo-mechanical design in silicon validation platforms

Content Provider	IEEE Xplore Digital Library
Author	Mohammed, R.K. Yi Xia Ying-Feng Pang Prabhugoud, M. Sahan, R.A.
Copyright Year	2009
Description	Author affiliation: Intel Corporation, MS: SC12-214, 3600 Juliette Lane, Santa Clara, CA-95054, USA (Mohammed, R.K.; Yi Xia; Ying-Feng Pang; Prabhugoud, M.; Sahan, R.A.)
Abstract	Validation platforms are used to validate processors/chipsets to ensure Intel providing world-class quality and reliable products. In this paper, experimental methodologies of thermal, mechanical, acoustics, shock and vibration and ergonomic tests are demonstrated. These tests are essential to enable the boot-out-of-the-box model with increased complexities of the platforms while meeting the budget and schedule. Component level thermal testing data are correlated with CFD simulations to provide guidance for system simulations. The choice of second level thermal interface material (TIM2) was implemented using the detailed thermo-mechanical test data. Next, the acoustic tests are performed to meet acoustic safety requirements and to implement fan control to minimize system noise. Structural tests validated the retention designs based on Finite Element (FE) analyses. The packaged system level shock and vibration tests demonstrated the ability of the packaged system to avoid damages during shipping. Ergonomic chassis lifting tests illustrated in this paper assist to meet safety and ergonomic requirements for validation platforms. The experimental results guide the thermo-mechanical design decisions for validation platforms during the development and deployment phases. The work presented in this paper will serve as a guideline to support future thermo-mechanical designs of validation platforms.
Starting Page	164
Ending Page	171
File Size	2934514
Page Count	8
File Format	PDF
ISBN	9781424436644
ISSN	10652221
e-ISBN	9781424436651
DOI	10.1109/STHERM.2009.4810759
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-03-15
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermomechanical processes Silicon Acoustic testing Ergonomics System testing Electric shock Vibrations Safety Packaging Processor scheduling ergonomic Validation platform experimental methodology thermal design mechanical design CFD TIM shock vibration acoustic
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Thermo-mechanical design challenges in silicon validation platforms

Thermo-mechanical reliability of SAC leadfree alloys

Thermo-mechanical reliability assessment for 3D through-Si stacking

Thermal and thermo-mechanical behavior of silicon platform with direct lead attachment

Vibration and thermo-mechanical durability assessments in advanced electronic package interconnects

Vibration, Shock and Intense Noise Testing for Reliability

Experimental validation of hygro/thermo-mechanical simulations for multi-material polymer structures [IC packaging applications]

Thermo-mechanical Design of Resilient Contact Systems for Wafer Level Packaging

Thermo-mechanical Stress of underfilled 3D IC packaging

Experimental techniques for thermo-mechanical design in silicon validation platforms

Similar Documents

Thermo-mechanical design challenges in silicon validation platforms

Thermo-mechanical reliability of SAC leadfree alloys

Thermo-mechanical reliability assessment for 3D through-Si stacking

Thermal and thermo-mechanical behavior of silicon platform with direct lead attachment

Vibration and thermo-mechanical durability assessments in advanced electronic package interconnects

Vibration, Shock and Intense Noise Testing for Reliability

Experimental validation of hygro/thermo-mechanical simulations for multi-material polymer structures [IC packaging applications]

Thermo-mechanical Design of Resilient Contact Systems for Wafer Level Packaging

Thermo-mechanical Stress of underfilled 3D IC packaging

Experimental techniques for thermo-mechanical design in silicon validation platforms