NDLI: Steady state model of a micro loop heat pipe

Content Provider	IEEE Xplore Digital Library
Author	Kim, J. Golliher, E.
Copyright Year	2002
Abstract	Loop Heat Pipes (LHP) have been demonstrated to be able to passively transport orders of magnitude more heat than conventional heat pipes, and offer other functional and performance advantages that have popularized its use in the aerospace industry. Developments at the NASA Glenn Research Center and the University of Cincinnati have produced micro-machining techniques for silicon that will be used to manufacture microchip scale LHP (/spl mu/LHP) with application potential for cooling of individual chips as an integrated package. To aid in its design and to ascertain its performance potential, a proven steady state analytical model developed by TTH Research for a large ammonia LHP was modified and further developed for microchip scale analysis with water working fluid. Without accounting for heat spreading efficiency across the evaporator wick surface, results show that the loop could accommodate more than 600 W/cm/sup 2/ of heat load. However, its operating (fluid) temperature was limited to >90/spl deg/C, even at moderate heat loads, regardless of condenser sink temperature, which could have adverse implications in terms of life and reliability of the component being cooled.
Starting Page	137
Ending Page	144
File Size	641364
Page Count	8
File Format	PDF
ISBN	0780373278
ISSN	10652221
DOI	10.1109/STHERM.2002.991359
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-03-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Steady-state Temperature Aerospace industry NASA Silicon Manufacturing Cooling Chip scale packaging Analytical models Performance analysis
Content Type	Text
Resource Type	Article

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