NDLI: Thermal performance characteristics of folded stacked packages

Content Provider	IEEE Xplore Digital Library
Author	Krishnan, S. Young-Gon Kim Mohammed, I.
Copyright Year	2002
Description	Author affiliation: Tessera Technol. Inc., San Jose, CA, USA (Krishnan, S.)
Abstract	The trend towards miniaturization and increased functionality has pushed for packaging more than one die together, while maintaining chip scale. Multi-chip packages consist of either vertical stacking of the die to reduce package footprint and/or placing dies adjacent to each other to improve functionality. The challenge lies in continuing to reduce the size while satisfying the stringent thermal, mechanical and electrical requirements of the wireless industry. One such solution in this area is the folded stacked technology developed by Tessera Technologies. In this design, the dies are placed side-by-side onto a substrate, which is then folded appropriately to obtain a low profile multi-chip CSP package. Their design allows the flexibility of different die sizes and die pad configurations to cater to different applications. Any multi-chip solution carries along with it the concern over its capability to dissipate heat quickly and effectively to prevent overheating of the die. Thus this work focuses on studying the thermal performance characteristics of a multi-die folded stack package.
Starting Page	42
Ending Page	49
File Size	1067525
Page Count	8
File Format	PDF
ISBN	0780373278
ISSN	10652221
DOI	10.1109/STHERM.2002.991344
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-03-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronic packaging thermal management Chip scale packaging Diodes Voltage Temperature Thermal resistance Surface resistance Electric variables measurement Integrated circuit measurements Semiconductor device measurement
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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