NDLI: Electrocoagulation as a viable technique to treat (Cu-)CMP wastes

Content Provider	IEEE Xplore Digital Library
Author	Van Hoeymissen, J.A.B. Van den Broeck, K. Van Hoornick, N. Heyns, M.
Copyright Year	2000
Description	Author affiliation: IMEC, Leuven, Belgium (Van Hoeymissen, J.A.B.)
Abstract	CMP has become a major process technology. As a result, high volumetric CMP waste streams containing suspended slurry particles and residues, polished from the wafer surface, are generated. This imposes severe demands on the treatment of these effluent streams, since the presence of the high TSS-content and metals like Cu and W is considered as environmental hazardous. In the present study it is demonstrated that the simple technique of electrocoagulation (EC) is a viable alternative to treat (Cu-)CMP wastes. A wide range of silica and alumina-based slurries (and mixtures thereof) have been tested in a lab-scale setup. Electrocoagulation has been found to destabilize in a relatively short time these suspensions. As a result, a transparent supernatant is formed, besides a compact, low volume sludge residual, which can be readily removed by simple, classical filtration. Moreover, the Cu and W present in the waste are removed from the liquid phase with efficiencies >99%, resulting in final metal concentrations below 100 ppb, thus well below water discharge limits. Experiments were done with both simulated and real wastes, which exhibited basically the same behavior.
Starting Page	313
Ending Page	316
File Size	430055
Page Count	4
File Format	PDF
ISBN	0780373928
ISSN	1523553X
DOI	10.1109/ISSM.2000.993676
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-09-26
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Suspensions Copper Wastewater treatment Slurries Silicon compounds Surface treatment Effluents Filtration Aluminum Electrodes
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in