NDLI: Block cross processing: an innovative approach to constraint management

Content Provider	IEEE Xplore Digital Library
Author	DeBoo, S.
Copyright Year	2000
Description	Author affiliation: Intel Corp., Rio Rancho, NM, USA (DeBoo, S.)
Abstract	Block cross processing (BXP) is an innovative system developed to provide manufacturing operations with a means for managing constrained areas of a process line using intra-site or inter-site material movement. This system is a proactive process that improves flexibility and increases capacity. The BXP system can be applied to any factories running a common process; it segments the fab process into several "blocks" that are identified as "technically safe" with respect to queue times, integrated yield issues, equipment and/or recipe matching, and capacity concerns. Blocks are a group of operation steps that range in size from 1 to about 10 operation steps depending on the technology and capacity issues within the block. Lots exercising BXP are processed through an entire block on a single manufacturing floor. BXP significantly reduced the amount of transferring between the two New Mexico 6" fab floors. In addition BXP data was used as a diagnostic tool for improving yield by identifying and closing unmatched "gaps" between different factories at a block level. This paper depicts the process used to develop and qualify BXP. It records key learning within the process and notes suggestions for possible improvements.
Starting Page	225
Ending Page	228
File Size	910959
Page Count	4
File Format	PDF
ISBN	0780373928
ISSN	1523553X
DOI	10.1109/ISSM.2000.993654
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-09-26
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Innovation management Production facilities Manufacturing processes Floors Throughput Manufacturing automation Manufacturing systems Production control Process planning Production planning
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Overhead intrabay automation and microstocking. A virtual fab case study

Integrated Planning of Production and Engineering Process Improvement

Reducing the start-up process duration for semiconductor facilities

Enabling Facility Re-Use for 300mm Semiconductor Manufacturing via Integration of Automated Material Handling System and Facility Design

Constraint management through the drum-buffer-rope system

300 mm fab automation technology options and selection criteria

Equipment automation framework with embedded Interface-A

Dynamic bottleneck control in wide variety production factory

Semiconductor business, process, product and fab influence on throughput, cycle time and chip cost

Block cross processing: an innovative approach to constraint management

Similar Documents

Overhead intrabay automation and microstocking. A virtual fab case study

Integrated Planning of Production and Engineering Process Improvement

Reducing the start-up process duration for semiconductor facilities

Enabling Facility Re-Use for 300mm Semiconductor Manufacturing via Integration of Automated Material Handling System and Facility Design

Constraint management through the drum-buffer-rope system

300 mm fab automation technology options and selection criteria

Equipment automation framework with embedded Interface-A

Dynamic bottleneck control in wide variety production factory

Semiconductor business, process, product and fab influence on throughput, cycle time and chip cost

Block cross processing: an innovative approach to constraint management