NDLI: Improving semiconductor manufacturing yields by using Raman spectroscopic analysis

Content Provider	IEEE Xplore Digital Library
Author	Obara, T. Tanakadate, J. Chabata, T. Ishihara, K. Mieno, F. Yanagihara, F.
Copyright Year	2000
Description	Author affiliation: Iwate Plant Manuf. Technol. Dept., Fujitsu Ltd., Iwate, Japan (Obara, T.)
Abstract	In order to implement effective countermeasures to improve yields, it is essential to analyze particles, clarify their material and determine their source in a short period of time. However, it took time to determine the source of particles using conventional particle analysis methods such as EDX and FT-IR, due to shortcomings arising from their measurement principles. Raman spectroscopic analysis is a method for analyzing particles which compensates for the insufficiencies of conventional analysis methods, so there is possibility that it will enable the determination of particle sources in a shorter period of time. We selected four types of 64 M D-RAM production equipment where particles originating from that manufacturing equipment were considered to be reducing yields.
Starting Page	273
Ending Page	276
File Size	607175
Page Count	4
File Format	PDF
ISBN	0780373928
ISSN	1523553X
DOI	10.1109/ISSM.2000.993666
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-09-26
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Spectroscopy Semiconductor device manufacture Raman scattering Chemical analysis Chemical elements Tiles Inspection Diffraction Particle measurements Time measurement
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

A new surface analysis method for semiconductor manufacturing, based on surface-potential measurements

Novel methodology to include all measured extension values per defect to improve defect size distributions

Metrology strategy for next generation semiconductor manufacturing

The effectiveness of defect-to-yield correlations [semiconductor manufacture]

Surface inspection system with automatic discrimination of microscratches and particles on chemical mechanical polished wafers

Operator error prevention system of semiconductor foundry manufacturing

Evaluation of an advanced wafer carrier for ILD planarization

Comparison of two wafer inspection methods for particle monitoring on semiconductor manufacturing

In line SEM inspection for yield learning in a manufacturing fabricator

Improving semiconductor manufacturing yields by using Raman spectroscopic analysis

Similar Documents

A new surface analysis method for semiconductor manufacturing, based on surface-potential measurements

Novel methodology to include all measured extension values per defect to improve defect size distributions

Metrology strategy for next generation semiconductor manufacturing

The effectiveness of defect-to-yield correlations [semiconductor manufacture]

Surface inspection system with automatic discrimination of microscratches and particles on chemical mechanical polished wafers

Operator error prevention system of semiconductor foundry manufacturing

Evaluation of an advanced wafer carrier for ILD planarization

Comparison of two wafer inspection methods for particle monitoring on semiconductor manufacturing

In line SEM inspection for yield learning in a manufacturing fabricator

Improving semiconductor manufacturing yields by using Raman spectroscopic analysis