NDLI: Advanced wet cleaning using novel nozzle and functional ultrapure water in next generation FPD/LSI manufacturing

Content Provider	IEEE Xplore Digital Library
Author	Mitsumori, K. Nobuaki, H. Takahashi, N. Imaoka, T. Ohmi, T.
Copyright Year	2000
Description	Author affiliation: Alps Electr. Co. Ltd., Tokyo, Japan (Mitsumori, K.)
Abstract	The advanced wet cleaning method relates to the fluid feed nozzle with ultrasonics that is employed for removing contaminants from the surfaces of the substrates during processes for manufacturing LCD or ULSI. In this method, the pressure among feeding and discharging cleaning solution and ambient air is balanced. This balance causes to feed adequate thickness of cleaning solution to remove particles from the substrate and to discharge waste solution and removed particles. The cleaning solution consumption of this method is less than 1/10 of conventional shower type nozzle with ultrasonic that has been popular in LCD fabrications. We named the nozzle using this method "balanced push-pull nozzle" (BPP-nozzle). The BPP-nozzle with ultrasonics and hydrogen-dissolved ultrapure water can remove PSL particles from above 30000 to about 100 in the Si-wafer cleaning.
Starting Page	329
Ending Page	332
File Size	578848
Page Count	4
File Format	PDF
ISBN	0780373928
ISSN	1523553X
DOI	10.1109/ISSM.2000.993680
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-09-26
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Cleaning Large scale integration Fabrication Ultra large scale integration Substrates Chemicals Feeds Glass Hydrogen Oxidation
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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