NDLI: Effective heat dissipation of high power LEDs mounted on MCPCBs with different thickness of aluminium substrates

Content Provider	IEEE Xplore Digital Library
Author	Soon Bee Law Permal, A. Devarajan, M.
Copyright Year	2012
Description	Author affiliation: Nano Optoelectronics Research Laboratory, Universiti Sains Malaysia, 11800 Minden, Penang, Malaysia (Soon Bee Law; Permal, A.; Devarajan, M.)
Abstract	This paper mainly discusses the thermal characterization of high power Light Emitting Diodes (LEDs). The Metal Core Printed Circuit Board (MCPCB) was designed with the aid of the recommended solder pad given in the product datasheet. Aluminium Nitride (AlN) was employed as the dielectric layer. Industrial grade aluminium (grade 5052) was utilized as the substrate material of the MCPCBs. The samples under test were varied in terms of substrate thickness on which the LEDs were mounted. The temperature rise at the junction and junction to ambient thermal resistance of the LEDs was investigated. The device performances were investigated with various substrate thicknesses under different ambient temperature at a fixed current input. The experimental results show that the increase in the substrate thickness greatly improved the thermal and optical performance of the LED packages. There were increments in the percentage of decrease in junction temperature rise and the percentage of decrease in the total thermal resistance which is from 19.8 % to 21.2 % and 15.2 % to 17.2 % respectively. The decreases in wall plug efficiency were reduced from 0.9% to 0.2%. Transient dual interface method was employed to determine the junction to board thermal resistance of the sample.
Starting Page	707
Ending Page	710
File Size	873880
Page Count	4
File Format	PDF
ISBN	9781467323956
e-ISBN	9781467323963
e-ISBN	9781467323949
DOI	10.1109/SMElec.2012.6417241
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-09-19
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Light emitting diodes Substrates Thermal resistance Junctions Aluminum Temperature measurement junction to ambient thermal resistance Metal core printed circuit board (MCPCB) dielectric material aluminium substrate thickness junction temperature rise thermal interface material junction to board thermal resistance
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in