NDLI: A study on surface charging reduction in Auger electron spectroscopy

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2014 IEEE International Conference on Semiconductor Electronics (ICSE2014)

2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)

2010 IEEE International Conference on Semiconductor Electronics (ICSE2010)

2008 IEEE International Conference on Semiconductor Electronics

2006 IEEE International Conference on Semiconductor Electronics

2004 IEEE International Conference on Semiconductor Electronics

2004 IEEE International Conference on Semiconductor Electronics (IEEE Cat. No.04EX917C)

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Table of contents

InP/InGaAs heterojunction phototransistors for optoelectronic receivers

Colloidal self-organization for nanoelectronics

Modeling and simulation for ESD protection circuit design and optimization

Low temperature bonding process for wafer-level MEMS packaging

On-line water quality monitoring on Brantas river East Java Indonesia

Reliability of MSQ spin-on glass as low-k interlayer dielectric in VLSI device

Effect of germanium cap layer on indium ohmic contacts for n-type GaAs

Influence of contact dimension on end resistance characterization for transmission line model

Modeling of diaphragms for micromachined condenser microphones

Condenser microphone performance simulation using equivalent circuit method

A new and effective method in failure analysis of gate oxide polysilicon capacitor structure

Advanced low temperature bonding technologies

A study of changes in oxide properties on metal-oxide-semiconductor (MOS) structure after electrical overstress

Performance enhancement of VHDL-AMS for DSP design

Characterization of indium and nitrogen co-implant of NMOSFET for advanced DRAM technologies with dual-gate oxide

Hydrogen sensitive Pt Schottky diode sensor based on GaN

Delay macro modeling of CMOS gates using modified logical effort technique

An automated tool deployment for ESD (electrostatic-discharge) correct-by-construction strategy in 90 nm process

A high-speed direct bootstrapped CMOS Schmitt trigger circuit

A design of high-speed, full-swing bootstrapped BiCMOS dynamic circuit

Studies on elimination solutions of galvanic corrosion on microchip Al bondpads in wafer fabrication and assembly processes

Failure analysis of bondpads peeling problem in 0.13 /spl mu/m copper process in wafer fabrication

A study on Al bondpad grain boundaries and galvanic corrosion in wafer fabrication

A study on surface charging reduction in Auger electron spectroscopy

Applications of XRD and TOF-SIMS in failure analysis of SiGe epi wafer

Studies on X-ray reflectivity technique and application in thickness measurements in wafer fabrication

Failure analysis of discolored and nonstick Al bondpad during wafer sorting process

Base doping profile effect in SiGe heterojunction bipolar transistors

Novel designs of NOR2 and NOR3 logic gates using single electron transistors

Capacitance extraction for the nanoscale on-chip interconnects

A self-consistent model for simulating the spectral response of quantum well photodetector

The effects of gate oxide short in 6-transistors SRAM cell

Analysis of fitted Suns-V/sub oc/ curves using two-diode model

Scattering parameters improvement in CPW MEMS shunt switches

A study on signature analyzer for design for test (DFT)

Design approach for tunable CMOS active inductor

ASIC design of a Kohonen neural network microchip

Digital hardware implementation of bus-based, field-ordered Hopfield network using VHDL

Influence of carrier statistics on InGaN/GaN device performance

Real time evolution of charge decay characteristics in silicon nanocrystals

Novel modelling for high-field current-voltage characteristics of semiconducting varistors

A low-power & low-noise 2.5-Gb/s optical receiver IC in 0.35 /spl mu/m CMOS

MEMS on/off and 1/spl times/2 optical switch with integrated fiber alignment capability

Die design of a transmitting transistor in a 175 MHz power amplifier at 28V

Emerging needs for test handler CDM ESD controls

Development of 3 dimensional visualization of semiconductor testing

Effect of shallow trench isolation induced stress on CMOS transistor mismatch

Characterization of tunneling current and breakdown voltage of advanced CMOS gate oxide

Partial gain-clamping in two-stage double-pass L-band EDFA using a ring resonator

Proposal of a new type magneto-transistor

Application of sodium hydroxide in analysis of gate oxide issue of leakage failures

Innovative approach of V and Z analysis for mix signal transceiver failure

Electrical properties of Ti/Ag contacts to n-type Al/sub 0.10/Ga/sub 0.90/N film grown on sapphire

Assembly of high power diode laser emitters

Clock gating methodology for high performance network processor in 90nm

Resolving gigabit at-speed failure analysis using current-resistance (I/R) analysis

Multi layer metallization scheme (Ni/Pd/Ag) ohmic contact on p-type GaN

A low voltage, high output impedance CMOS current source

Tree-based transistor topology extraction algorithm for library-free logic synthesis

Design of a low power CVSL full adder using low-swing technique

Optical properties of GaN on sapphire substrates grown by plasma-assisted MOCVD

Advanced current mirrors for low voltage analog designs

Semiconductor device simulation using filter bank transforms

Failure analysis on wafer edge issue in 0.13/spl mu/m technology

Parameter specific supply voltage scaling by evaluating the frequency of an onchip ring-inverter-chain

Copper dendrite growth and analysis on copper damascene process

Optical waveguide coupler fabrication based on time variation ion-exchange technique

Non-symmetric Mach-Zehnder interferometer wavelength filter

Wavelet based non-uniform mesh generation for simulation time reduction of semiconductor device modeling

A novel composite cell based, constant-g/sub m/, rail-to-rail CMOS input-stage

A comparison between two solution approaches for diaphragm-based capacitive pressure microsensor

The surface site dehydration mechanism for Si/sub 3/N/sub 4/ sensing membrane by post-baking treatment

Nitrogen effects on the sensitivity of tantalum nitride (Ta/sub x/N) for ion sensing devices

Application of Auger electron spectroscopy (AES), TEM electron energy loss spectrum (EELS) in failure analysis on poly grooves issue in wafer fabrication

A new approach for multi wavelength dynamic analysis of semiconductor laser amplifier using numerical method

The development of partial encryption of compressed images algorithm: VHDL approach

The FPGA approach in the design and development of an automated rail transit system controller

Recent advances in the integrated circuit design of RFID transponder

Simulation of an analog differential capacitive accelerometer

Suspension design analysis on the performance of MEMS area-changed lateral capacitive accelerometer

Cleanroom contamination monitoring using FTIR

A passive telemetry LC pressure sensor optimized for TPMS

Development of tire condition monitoring system (TCMS) based on MEMS sensors

Mechanical behaviour of a 10g MEMS noncrossing differential capacitive accelerometer

Electrical characteristics of Al/sub 0.22/Ga/sub 0.78/As/In/sub 0.22/Ga/sub 0.78/As PHEMT with gate length in nano regime

Hybrid WDM/OCDMA system to support differentiated services in access network

Implementation of triple data encryption algorithm using VHDL

Design of a SOC for low cost IC testing

Synthesis of silicon nanowires

University-industry partnership in microengineering and nanoelectronic in Malaysia

An alternative doping technique of polysilicon gate for sub-micron CMOS/BiCMOS devices

Convex-corner undercutting on corrugated diaphragm

Realization of perfect silicon corrugated diaphragm using KOH etching

Mode analysis of long-wavelength vertical-cavity surface-emitting lasers diode

Blue organic light emitting diode (OLED) from two-layer structure of 4,4'-bis(2,2'diphenylvinil)-1,1'-biphenyl (DPVBi) and PVK

BaTiO/sub 3/ nanocomposite thin film as pyroelectric sensor

Comparison study of uniformly-doped and delta-doped Al/sub 0.22/Ga/sub 0.78/As/In/sub 0.22/Ga/sub 0.78/As pseudomorphic HEMTs

The study of etching selectivity between InGaAs and AlGaAs in acid based etching solution

The etching of GaAs, AlGaAs and InGaAs in different chemicals in p-HEMT mesa layers

Design of 2.5V, 900MHz phase-locked loop (PLL) using 0.25/spl mu/m TSMC CMOS technology

A 1.8-V fully differential 2-stage OPAMP switched-capacitor delta-sigma modulator for Bluetooth application

Design characterization of a 1.2V 900MHz CMOS current mode down-conversion mixer with filter

Encoding characteristics of a 2 channel optical motion detector

Temperature and zincation process effect on electrical resistivity of aluminum bond pad for under bump metallurgy (UBM)

Glass based 16 channels arrayed waveguide grating by ion exchange technique

Characterisation and process optimisation of photosensitive acrylates for polymeric optical waveguides

Polymer thermooptic switch for C-band based on multimode interference Mach-Zehnder interferometer

Optical waveguide polymer curing study using FTIR spectroscopy

Conventional arrayed waveguide grating with 4 channel structure design for CWDM

Design of GaAs-based pseudomorphic HEMTs by 2D device simulations

Determination of thermo-optic coefficient of a UV curable polymer using prism coupling technique

Characterization of wet etching process for In/sub 0.53/Ga/sub 0.47/As epitaxy layer using surface profiling technique

Magnetoresistance studies of metallic granular and ceramic thin films for microsensor applications

Magnetoresistance effect of Cu/Cu-Co hybrid multilayer films

Effect of Pr substitution on magnetoresistance in La/sub 2/3/Ba/sub 1/3/MnO/sub 3/ perovskite

Photothermal study of ceramic ZnO doped with MnO

SilTerra's experience in developing multi-skills technician

The design of batteryless, TIRIS/spl reg/-compliant RFID transponder IC employing TSMC 0.18/spl mu/m process

Fuzzy logic-based temperature regulator for industrial application: software and hardware approaches

Fabrication of polymeric optical waveguides by B-staged bisbenzocyclobutene (BCB)

Design and characterization of input and output (I/O) pads

Study and application of wright etch in sub-quarter-micron technology

Digital modelling for op-amp circuit test

Probeless electrical fault isolation approach: a breakthrough logic and circuit simulation based failure analysis method

Effects of body contact on output characteristics of 0.5 micron MOSFET on thick bonded SOI substrate

Design of low voltage operational amplifier

SPICE model for microwave properties of traveling-wave electroabsorption modulators

Implementation of wavelet shrinkage de-noising based on DSP

The polarity dependence of capacitances for HfO/sub 2/ affected by post-CF/sub 4/ plasma treatment

Ion sensing improvements of hafnium oxide by nitrogen incorporation

Interleavers/Deinterlevers based On Michelson-Gires-Tournois Interferometers with Different Structures

Evanescent optical field calculation with FDTD method

Optimization of Optical and Electrical Behavior of Quantum Well GaN-Based LED

An investigation of gain and gain frequency spectrum in a semiconductor optical amplifier using numerical representation

High-temperature Pd Schottky diode gas sensor on p-type GaN

Design and simulation of simple and varying section cantilever and fixed-fixed end types MEMS switches

Bismuth titanate thin film for pressure sensor prepared by sol gel method

An analytical threshold voltage model of NMOSFETs with hot-carrier induced interface charge effect

Study of coreless planar inductor at high operating frequency

Deflection analysis of epitaxially deposited polysilicon encapsulation for MEMS devices

Application of barium strontium titanate thin film as distance sensor

Electrical humidity response of sol-gel processed LiCl-doped SiO/sub 2/ thin films

The effects of solvent on the performances of polymer light emitting diode

A stannic dioxide sensor array system for organophosphorus insecticides detection

Educational Java applets for MOS capacitor

On the use of MEMs accelerometer to detect fatigue department

Alternative double pass dicing method for thin wafer laminated with die attach film

An alternative approach to measures the application of dispatching rule in the wafer foundry

A simulation approach for dispatching techniques comparison in 200mm wafer foundry

Some aspects of surface morphology and elemental analysis study on non-wetting problem at die top

The effects of zincation process on aluminum bond pad surfaces for electroless nickel immersion gold (ENIG) deposition

Electrostatic pull-in behavior in 50g force balanced MEMS accelerometer

Scaling-down effects on the electrical performance of top-contact pentacene TFTs

Finger beam geometrical behavior analysis of a non-crossing differential capacitive MEMS accelerometer

Effect of Energy Contamination on the P-Channel Transistor Characteristics

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ICONIP '02. Proceedings of the 9th International Conference on Neural Information Processing. Computational Intelligence for the E-Age (IEEE Cat. No.02EX575)

ICSE 2000. 2000 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.00EX425)

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A study on surface charging reduction in Auger electron spectroscopy

Content Provider	IEEE Xplore Digital Library
Author	Ramesh Rao, N. Tan Chin Wang Hua Younan Lo Keng Foo
Copyright Year	2004
Description	Author affiliation: Chartered Semicond. Mfg Ltd., Singapore, Singapore (Ramesh Rao, N.; Tan Chin Wang; Hua Younan; Lo Keng Foo)
Abstract	In this paper, a simple method of charge reduction on the surface of an insulating sample and its usefulness in the analysis of Auger electron spectroscopy (AES) data is presented. Surface charge build up can give rise to an AES spectrum with poor signal to noise ratio, spurious peaks and shift in peak energy. In a recent study of Au fingers on a printed circuit board (PCB), heavy charging was observed. Focused ion beam (FIB) technique was used to deposit and pattern Pt wires (/spl sim/ 0.5/spl mu/m thick) such that an electrical conduction path is created from the Au finger to neighboring Al foils. The merits of the technique are discussed in this paper, especially in the context of miniature sized features often encountered in microelectronics industry.
File Size	1667727
File Format	PDF
ISBN	0780386582
DOI	10.1109/SMELEC.2004.1620844
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-12-07
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Surface charging Electrons Spectroscopy Gold Fingers Insulation Signal to noise ratio Printed circuits Ion beams Wires
Content Type	Text
Resource Type	Article

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