NDLI: Improvement for bond pads discolor (sic) of CMOS image sensor products

Content Provider	IEEE Xplore Digital Library
Author	Chih-Hsing Chen Hong-Wen Huang Chih-Chen Kuo Hung-Jen Tsai
Copyright Year	2001
Description	Author affiliation: Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan (Chih-Hsing Chen)
Abstract	The CMOS image sensor is covered with a color filter. Bond pads discoloration was found after the color filter process. SEM analysis showed metal loss of the bond pads, and residues in the discolored area. EDS results showed the residues contained mostly C and O elements, indicating photoresist residues. These defects caused package reliability problems based on a bondability test. Color filter processes are composed of multicolor photoresist layers. During several development processes most of the metal was lost, inducing metal film roughness and then causing photoresist residues on the bond pads. In order to improve bond pads discoloration, two methods for the color filter processes were evaluated: (1) decreased rework (development process) frequency, and (2) added bond pads protection, which showed some success.
Sponsorship	IEEE
Starting Page	77
Ending Page	78
File Size	260265
Page Count	2
File Format	PDF
ISBN	0780374320
DOI	10.1109/ISDRS.2001.984442
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-12-05
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	ISDRS-Univ of Maryland
Subject Keyword	Bonding Atherosclerosis CMOS image sensors Filters Color Computational Intelligence Society Scanning electron microscopy Protection Resists Frequency
Content Type	Text
Resource Type	Article

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