NDLI: Reactive ion etching for patterning high aspect ratio and nanoscale features

Content Provider	IEEE Xplore Digital Library
Author	Avram, M. Avram, A. Comanescu, F. Popescu, A.M. Voitincu, C.
Copyright Year	2009
Description	Author affiliation: National Institute for Research and Development in Microtechnologies, Romania, Bucharest (Avram, M.; Avram, A.; Comanescu, F.; Popescu, A.M.; Voitincu, C.)
Abstract	This paper presents the authors' understanding of the mechanistic aspects of the role of energetic ion bombardment in low density plasma reactive ion etching (RIE). The phenomenon of ion assisted gas surface chemistry is described and the importance of this phenomenon in obtaining anisotropic is emphasized. It was studied the dependence of etching rate of RF power and pressure in reactor. RF power and pressure in the reactor has significant effect not only on the etching rate, but also on the degree of anisotropy and etching profiles for various RF power and pressure in the reactor.
Starting Page	253
Ending Page	256
File Size	768443
Page Count	4
File Format	PDF
ISBN	9781424444137
ISSN	1545827X
DOI	10.1109/SMICND.2009.5336554
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-10-12
Publisher Place	romania
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Plasma applications Plasma chemistry Hydrogen Dry etching Radio frequency Inductors Chemicals Hafnium Anisotropic magnetoresistance Plasma accelerators nanoscale patterning reactive ion etching
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Highly Chemical Reactive Ion Etching of Silicon in CF4 Containing Plasmas

The black silicon method. VI. High aspect ratio trench etching for MEMS applications

Reactive ion etching for failure analysis applications

Characterization of reactive ion etching of polysilicon over gate oxide for failure mode analysis deprocessing

Deep Submicron Dry Etching

Patterning of nanoscale Si lines using e-beam lithography and high-selectivity plasma etching

Metal gate stack plasma patterning studies

Reactive Ion Etching of Piezoelectric Films for Acoustic Wave Devices

Dry Processes for Patterning

Reactive ion etching for patterning high aspect ratio and nanoscale features

Similar Documents

Highly Chemical Reactive Ion Etching of Silicon in CF4 Containing Plasmas

The black silicon method. VI. High aspect ratio trench etching for MEMS applications

Reactive ion etching for failure analysis applications

Characterization of reactive ion etching of polysilicon over gate oxide for failure mode analysis deprocessing

Deep Submicron Dry Etching

Patterning of nanoscale Si lines using e-beam lithography and high-selectivity plasma etching

Metal gate stack plasma patterning studies

Reactive Ion Etching of Piezoelectric Films for Acoustic Wave Devices

Dry Processes for Patterning

Reactive ion etching for patterning high aspect ratio and nanoscale features