NDLI: Nanofiber ACFs (anisotropic conductive films) for ultra-fine pitch interconnection

Content Provider	IEEE Xplore Digital Library
Author	Kyung-Wook Paik Sang-Hoon Lee Tae-Wan Kim
Copyright Year	2015
Description	Author affiliation: Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea (Kyung-Wook Paik; Sang-Hoon Lee; Tae-Wan Kim)
Abstract	The demands of smart devices such as smart phones or tablet PCs has risen dramatically over the last decades. Also the display technology has been continuously evolved into higher resolution technology such as ultra high definition (UHD) resulting in more I/O pins required. Therefore, ultra fine pitch packaging and interconnection technology has become very important in assembly processes. In electronic packaging industry, anisotropic conductive films (ACFs), well known adhesive interconnecting materials, consist of thermosetting resin and conductive particles in a film format, have been widely used. However, as the pitch has been narrowed, interconnection problems such as short circuit issue and high contact resistance issues have been raised with conventional ACFs bonding. As a result, a novel concept of ACFs called “nanofiber ACFs” was introduced before to solve these problems by our research group. Combining nanofiber and ACFs technology can provide a promising solution for fine pitch interconnection. Nanofiber can suppress the free movement of conductive particles of ACFs to prevent electrical interconnection problems such as short or high contact resistance.
Starting Page	581
Ending Page	587
File Size	1370211
Page Count	7
File Format	PDF
e-ISBN	9781467381567
DOI	10.1109/NANO.2015.7388671
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-07-27
Publisher Place	Italy
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Contact resistance Electrodes Insulation Integrated circuit interconnections Reliability Resins Flex-on-Flex (FOF) anisotropic conductive films (ACFs) nanofiber ultra-fine pitch Chip-on-Glass (COG)
Content Type	Text
Resource Type	Article

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