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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Mircea, I. Fatikow, S. Sill, A. |
| Copyright Year | 2007 |
| Description | Author affiliation: Dept. of Comput. Sci., Oldenburg Univ., Oldenburg (Mircea, I.; Fatikow, S.; Sill, A.) |
| Abstract | Microrobot-based nanoindentation is a relatively new testing technique, which uses microrobot based methods for performing nanoindentation experiments. The use of the microrobot-based nanoindentation is a example how microrobotic technology can help the materials research. In this work, the hardness of an epoxy-based silver-filled electrically conductive adhesive (ECA) type PC 3002 has been determined using this method. Flat ECA specimens have been investigated after a first curing at 70degC for 120 minutes, respectively after a curing time of 150 minutes, 180 minutes, 240 minutes, 300 minutes, and finally after 325 minutes at the same temperature. The maximum indentation depth was 1 mum. The hardness of the ECA has shown an increase with the increase of the curing time at constant temperature. The set-up uses a Berkovich diamond tip for performing nanoindentation tests. The set-up requires calibrations with reference specimens (fused silica and sapphire) for calculating hardness and Young's modulus of the tested material. Preliminary results are very promising: by comparing the slope of the loading stage of the nanoindentation tests on different specimens, the difference in hardness can be qualitatively evidenced. |
| Starting Page | 719 |
| Ending Page | 722 |
| File Size | 311491 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424406074 |
| DOI | 10.1109/NANO.2007.4601289 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-08-02 |
| Publisher Place | Hong Kong |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Materials Curing Conductive adhesives Force measurement Calibration Robot sensing systems Conductivity microrobotics electrically conductive adhesive hardness nanoindentation microelectronics |
| Content Type | Text |
| Resource Type | Article |
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