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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Stamper, A.K. Chou, A. Hook, T.B. |
| Copyright Year | 2000 |
| Description | Author affiliation: IBM Microelectron., Essex Junction, VT, USA (Stamper, A.K.) |
| Abstract | Due to growing integrated circuit (IC) performance requirements, dual-gate oxide thickness and damascene-copper wiring are increasingly being employed by the IC industry. Charging damage behavior for 0.22-micron (3.5-nm oxide), 0.18-micron (2.7-nm/3.8-nm oxide), and 0.16-micron (3.5-nm/6.8-nm oxide) generation damascene-copper wiring technologies has been investigated. Charging damage manifests itself in four areas: elevated gate-oxide leakage currents, threshold voltage shifts, increased hot-carrier sensitivity, and early gate-oxide dielectric breakdown. The PFET devices generally displayed higher gate-oxide leakage currents, threshold-voltage shifts, and hot-carrier sensitivity than the NFET devices. For the dual-gate oxide thickness technologies, the thick oxide was more susceptible to charging damage than the thin oxide for a given oxide thickness. The thicker of the two oxides in the dual-gate oxide thickness technologies was invariably found to be more susceptible to charging damage, even when an oxide of that same thickness was damage-free in a single oxide-thickness technology. Charging damage had no measurable effect on the gate-oxide breakdown voltage distribution, although the NFET devices had more early breakdown voltage fails than the PFET devices. |
| Starting Page | 109 |
| Ending Page | 112 |
| File Size | 381260 |
| Page Count | 4 |
| File Format | |
| ISBN | 0965157741 |
| DOI | 10.1109/PPID.2000.870629 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2000-05-22 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | American Vacuum Soc. |
| Subject Keyword | Copper CMOS technology Wiring Integrated circuit technology Leakage current Threshold voltage Etching Chemical vapor deposition Electron traps Hot carriers |
| Content Type | Text |
| Resource Type | Article |
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