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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Bhuva, B. Mongkolkachit, P. Bui, N. Kerns, S. |
| Copyright Year | 1999 |
| Description | Author affiliation: Dept. of EECE, Vanderbilt Univ., Nashville, TN, USA (Bhuva, B.) |
| Abstract | The hot-carrier response of a device is an accurate measure of the gate oxide integrity. Differences in hot-carrier lifetimes for plasma etched devices depend on the tunneling current (and the resultant changes in charge trap density) in the oxide during etch. The pre-stress device parameters are a strong function of the active charge traps in the oxide. Thus, pre-stress device parameters can be used to estimate the post-hot-carrier-stress response of plasma-etched devices. Our study, using LDD MOSFETs, shows a linear relationship between pre-stress and post-stress device characteristics. Thus, post-stress behavior of plasma-etched devices can be predicted from pre-stress data, simplifying wafer-level reliability and device characterization. |
| Starting Page | 69 |
| Ending Page | 72 |
| File Size | 231805 |
| Page Count | 4 |
| File Format | |
| ISBN | 0965157733 |
| DOI | 10.1109/PPID.1999.798815 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1999-05-09 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | American Vacuum Soc. |
| Subject Keyword | Hot carriers Hot carrier effects Plasma applications Plasma devices Plasma density Plasma measurements Etching Plasma properties Tunneling MOSFETs |
| Content Type | Text |
| Resource Type | Article |
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