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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Mingching Wu Chun-Feng Lai Weileun Fang |
| Copyright Year | 2004 |
| Description | Author affiliation: Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan (Mingching Wu; Chun-Feng Lai; Weileun Fang) |
| Abstract | This work integrates multi-depth DRIE etching, two-poly MUMPs, and bulk releasing to accomplish superior poly-Si micro-optical systems. The stiffness of the devices was significantly increased using the trench-refilled rib structure, so that the radius of curvature (ROC) of the 2 /spl mu/m thick mirror even reached 150 mm. In addition, the space between the devices and the substrate was remarkably increased to /spl sim/100 /spl mu/m by bulk silicon etching. Moreover, the self-aligned vertical comb actuators were available through the multi-depth DRIE etching. In application, the scanning mirrors driven by vertical comb actuator were demonstrated. The scanning angle was /spl plusmn/3 degrees (optical angle) at 40 V driving voltages (DC) and resonant frequency was 1.8 kHz. These poly-Si micro-optical devices can further integrate with the MUMPs devices to establish a more powerful MOEMS platform. |
| Sponsorship | IEEE Robotics and Automation Soc |
| Starting Page | 97 |
| Ending Page | 100 |
| File Size | 319596 |
| Page Count | 4 |
| File Format | |
| ISBN | 078038265X |
| DOI | 10.1109/MEMS.2004.1290531 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2004-01-25 |
| Publisher Place | Netherlands |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Micromachining Etching Silicon Mirrors Optical films Actuators Electrodes Voltage Optical devices Residual stresses |
| Content Type | Text |
| Resource Type | Article |
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