NDLI: Normally-closed, leak-tight piezoelectric microvalve under ultra-high upstream pressure for integrated micropropulsion

Content Provider	IEEE Xplore Digital Library
Author	Eui-Hyeok Eh Choonsup Lee Mueller, J.
Copyright Year	2003
Description	Author affiliation: Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA (Eui-Hyeok Eh; Choonsup Lee; Mueller, J.)
Abstract	This paper presents a leak-tight piezoelectric microvalve, operating at extremely high upstream pressures for microspacecraft applications. The device is a normally-closed microvalve fabricated mostly by the micromachining of silicon wafers. The microvalve consists of a custom-designed piezoelectric stack actuator bonded onto silicon valve components, such as the seat, boss and tether, in a stainless steel housing. Major seating configurations include narrow edge seating rings and tensile-stressed silicon tethers that contribute to the desired normally-closed leak-tight operation. The microvalve operations have been demonstrated with a 'helium leak detector scale' leak rate of 10/sup -4/ sccm at 800 psi. Dynamic microvalve operations of up to 1 kHz have been successfully demonstrated at the pressures in the range of 0/spl sim/1000 psi. The measured static flow rate of a microvalve with an applied potential of 10 V is 52 sccm at an inlet pressure of 300psi. The measured power consumption, to hold the microvalve seat fully open, is 3 mW with the applied potential of 30 V. The measured dynamic power consumption is 180 mW for 100 Hz continuous operation at 100 psi.
Starting Page	80
Ending Page	83
File Size	322107
Page Count	4
File Format	PDF
ISBN	0780377443
ISSN	10846999
DOI	10.1109/MEMSYS.2003.1189692
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-01-23
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microvalves Silicon Pressure measurement Power measurement Energy consumption Micromachining Piezoelectric actuators Wafer bonding Valves Steel
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Mechanical Engineering Electrical and Electronic Engineering

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