NDLI: Flexible shear stress sensor skin for aerodynamics applications

Content Provider	IEEE Xplore Digital Library
Author	Fukang Jiang Yong Xu Tianxiang Weng Zhigang Han Yu-Chong Tai Huang, A. Chih-Ming Ho Newbern, S.
Copyright Year	2000
Description	Author affiliation: California Inst. of Technol., Pasadena, CA, USA (Fukang Jiang)
Abstract	Packaging for a large distributed sensing system is a challenging topic. Using flexible skin technology solves many of these problems. Combining with the newly developed backside contact technique, sensor packaging is made even easier by completely avoiding the fragile bonding wires. This paper describes the improved flexible MEMS technology and its application to the fabrication and packaging of practical shear stress sensor skins. An airflow separation detection system including these skins, MOSIS bias circuits and a data acquisition unit has been successfully tested in windtunnel and is being used for the aerodynamic study of a MEMS controlled super-maneuverable low-altitude unmanned aerial vehicle (UAV).
Starting Page	364
Ending Page	369
File Size	652849
Page Count	6
File Format	PDF
ISBN	0780352734
ISSN	10846999
DOI	10.1109/MEMSYS.2000.838544
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-01-27
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Stress Skin Aerodynamics Packaging Micromechanical devices Circuit testing Unmanned aerial vehicles Bonding Wires Fabrication
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Mechanical Engineering Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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