NDLI: Theory, technology and assembly of a highly symmetrical capacitive triaxial accelerometer

Content Provider	IEEE Xplore Digital Library
Author	Lotters, J.C. Olthuis, W. Veltink, P.H. Bergveld, P.
Copyright Year	1997
Description	Author affiliation: MESA Res. Inst., Twente Univ., Enschede, Netherlands (Lotters, J.C.)
Abstract	A highly symmetrical cubic easy-to-assemble capacitive triaxial accelerometer for biomedical applications has been designed, realized and tested. The outer dimensions of the sensor are 5/spl times/5/spl times/5 mm/sup 3/ and the device is mounted on a standard IC package. New aspects of the sensor are an easy assembly procedure, the use of the polymers polydimethylsiloxane (PDMS) as spring material between the capacitor plates and the mass and polyimide (PI) as flexible interconnection layer between the capacitor plates, and the highly symmetrical cubic structure. The mathematical model, technology and assembly procedure of the sensor are described. The measurement results show a good linearity in the output voltage for accelerations up to at least 5 g and a bandwidth of DC >50 Hz. In the x-axis the sensitivity was found to be 175 mV/g which is in good correspondence with the theory. The sensitivity can be increased when the PDMS layer is patterned, which was shown in previous versions of the highly symmetrical triaxial accelerometer.
Starting Page	31
Ending Page	36
File Size	678056
Page Count	6
File Format	PDF
ISBN	0780337441
ISSN	10846999
DOI	10.1109/MEMSYS.1997.581760
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-01-26
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Accelerometers Biosensors Capacitors Testing Integrated circuit packaging Capacitive sensors Polymers Springs Polyimides
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Mechanical Engineering Electrical and Electronic Engineering

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