NDLI: Integrated test chips improve IC assembly

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Integrated test chips improve IC assembly

Content Provider	IEEE Xplore Digital Library
Author	Sweet, J.N.
Copyright Year	1988
Abstract	The use of test dies integrated with a semiconductor wafer to gauge environmental stresses effectively during the packaging and processing phases is discussed. These special-purpose assembly test chips (ATCs) are designed primarily for studying failures of the package-centered and composite types. These chips usually provide a way to stress the die, and they include transducers for monitoring the die's response to the stress. A variety of structures has been used to measure parameters associated with package-related failures. Corrosion detectors, moisture detectors, mechanical stress sensors, mobile ion sensors, thermal resistance measurement circuits, and multifunction test chips are examined.<>
Starting Page	39
Ending Page	45
Page Count	7
File Size	1028658
File Format	PDF
ISSN	87553996
Volume Number	6
Issue Number	5
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1990-09-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit testing Assembly Thermal stresses Semiconductor device packaging Electrical resistance measurement Detectors Mechanical sensors Thermal sensors Circuit testing Semiconductor device testing
Content Type	Text
Resource Type	Article
Subject	Instrumentation Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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