NDLI: A comparative study of ULK conduction mechanisms and TDDB characteristics for Cu interconnects with and without CoWP metal cap at 32nm technology

Content Provider	IEEE Xplore Digital Library
Author	Chen, F. Huang, E. Shinosky, M. Angyal, M. Kane, T. Wang, Y. Kolics, A.
Copyright Year	2010
Description	Author affiliation: IBM Microelectronics, 52 Hopewell Junction, NY 12533 (Angyal, M.; Kane, T.; Wang, Y.) \|\| IBM Microelectronics, 1000 River Street, Essex Junction, VT, 05452 (Chen, F.; Shinosky, M.) \|\| IBM Thomas J. Watson Research Center, Yorktown Heights, NY 10598, USA (Huang, E.) \|\| Lam Research Corporation, Fremont, CA (Kolics, A.)
Abstract	As the current-carrying capability of a copper line is reduced due to interconnect dimension shrinkage, self-aligned CoWP metal-cap has been reported to be helpful to improve degraded electromigration (EM) reliability. However, adoption of this new metal cap in general further exacerbates the already problematic low-k dielectric TDDB reliability at 32nm and beyond. This paper provides a comparative study of ULK conduction mechanisms over a wide range of temperature (30 ºC to 295 ºC) and TDDB acceleration kinetics at 125 ºC for Cu interconnects with and without CoWP metal cap at 32nm technology. It was found that adding CoWP didn't change the fundamental ULK leakage conduction mechanism and TDDB kinetics if its process was optimized. Comparable leakage and TDDB performance were achieved with an optimized CoWP process.
Starting Page	1
Ending Page	3
File Size	470987
Page Count	3
File Format	PDF
ISBN	9781424476763
e-ISBN	9781424476787
DOI	10.1109/IITC.2010.5510693
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-06-06
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper Dielectrics Voltage Microelectronics Degradation Temperature distribution Kinetic theory Testing Leakage current Stress
Content Type	Text
Resource Type	Article

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