NDLI: Electrical characterization of a pressed contact between a power chip and a metal electrode

Content Provider	IEEE Xplore Digital Library
Author	Vagnon, E. Avenas, Y. Crebier, J.C. Jeannin, P.O. Al Batta, I. Besri, A.
Copyright Year	2009
Description	Author affiliation: Grenoble Electr. Eng., Grenoble Univ., Grenoble, France (Vagnon, E.; Avenas, Y.; Crebier, J.C.; Jeannin, P.O.; Al Batta, I.; Besri, A.)
Abstract	This study deals with the power electronics packaging and the needs for additional knowledge about electrical pressed contact behavior. For this, a measure bench has been realized. It is able to characterize the pressed interface between a metal electrode and a power chip as a function of the clamping force (0-8000N) and the temperature (up to 100°C). First measurement results show that the electrical contact resistance is negligible compared to the chip on-state voltage. Second measurement results show that the high value of the chip metallization resistance masks also the contact resistance. Finally, it appears that it is necessary to estimate the chip contact zone influences on the current repartition. Then a method based on both, the use of a chip model and the measurements directly on the chip, has been developed. It is able to look for the steady state current repartition in the chip as a function of the contact zone and the chip metallization physical parameters.
Sponsorship	IEEE Instrum. Meas. Soc.
Starting Page	1738
Ending Page	1743
File Size	702442
Page Count	6
File Format	PDF
ISBN	9781424433520
ISSN	10915281
DOI	10.1109/IMTC.2009.5168738
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-05-05
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electrodes Electrical resistance measurement Semiconductor device measurement Contact resistance Electric resistance Metallization Power electronics Electronics packaging Clamps Temperature power chip component Pressed contact Electrical contact resistance measurement
Content Type	Text
Resource Type	Article
Subject	Instrumentation Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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