NDLI: Hybrid telemetric MEMS for high temperature measurements into harsh industrial environments

Content Provider	IEEE Xplore Digital Library
Author	Marioli, D. Sardini, E. Serpelloni, M. Ando, B. Baglio, S. Savalli, N. Trigona, C.
Copyright Year	2009
Description	Author affiliation: Dip. di Elettron. per l'Autom., Univ. of Brescia, Brescia, Italy (Marioli, D.; Sardini, E.; Serpelloni, M.) \|\| Dip. di Ing. Elettr., Elettron. e dei Sist., Univ. of Catania, Catania, Italy (Ando, B.; Baglio, S.; Savalli, N.; Trigona, C.)
Abstract	A temperature sensor that could be interrogated contactless represents an attractive solution for measurements into harsh environments such as in presence of high temperatures that do not permit the correct working of electronics. This paper discusses a telemetric system consisting of two coupled planar inductors, which constitute a coupled transformer with the primary one connected to the measurement electronics and the secondary one to a capacitive MEMS sensor that is designed for high-temperature environments. The proposed hybrid sensor is composed by the capacitive MEMS bonded to the planar inductor. The hybrid sensor behaves as an LC resonant circuit in which the MEMS represents the capacitance and the planar inductor is the inductance. The whole system has been tested in the laboratory and several results are reported. The proposed telemetric temperature system can be a solution for efficiency monitoring and predictive maintenance for harsh and complex environments.
Sponsorship	IEEE Instrum. Meas. Soc.
Starting Page	1423
Ending Page	1428
File Size	1483421
Page Count	6
File Format	PDF
ISBN	9781424433520
ISSN	10915281
DOI	10.1109/IMTC.2009.5168678
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-05-05
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Telemetry Micromechanical devices Temperature measurement Temperature sensors Inductors Capacitive sensors Coupling circuits Sensor systems Bonding RLC circuits Process Control High Temperature Measurement Wireless System MEMS Contactless Telemetric System Predictive Maintenance
Content Type	Text
Resource Type	Article
Subject	Instrumentation Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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