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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Zabasajja, John Sokol, Jennifer Laraia, Vince Fritz, Matthew Xie, Junqing Gould, Charles |
| Copyright Year | 2014 |
| Description | Author affiliation: 3M Electronic Materials Solutions Division, St. Paul, MN 55144, USA (Zabasajja, John; Sokol, Jennifer; Laraia, Vince; Fritz, Matthew; Xie, Junqing; Gould, Charles) |
| Abstract | In this paper, a novel pad conditioner, $3M^{TM}$ $Trizact^{TM}$ Pad Conditioner, B6-M990, consisting of precisely engineered microreplicated abrasive structures coated with a chemical vapor deposited (CVD) diamond film is demonstrated for Front End Of Line (FEOL) Tungsten plug and metal gate applications. Baseline marathon data of W plug and gate processes, comparing the Trizact™ Pad Conditioner to a diamond grit pad conditioner (DG) were generated on a 300 mm AMAT $Reflexion^{®}$ tool. In-situ and ex-situ conditioning processes showed that the pad/conditioner lifetime could be extended by at least a factor of 3 using B6-M990 Trizact™ Pad Conditioner versus the diamond grit conditioner while maintaining the same W and TEOS removal rates. |
| Starting Page | 311 |
| Ending Page | 314 |
| File Size | 355862 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479955565 |
| e-ISBN | 9781479955572 |
| DOI | 10.1109/ICPT.2014.7017307 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-11-19 |
| Publisher Place | Japan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Planarization TEOS Tungsten Microreplication Diamonds Logic gates Slurries Metal gate Testing |
| Content Type | Text |
| Resource Type | Article |
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