NDLI: Massive spalling in Pb-free solder on co-based surface finishes

Content Provider	IEEE Xplore Digital Library
Author	Chun-Hao Huang Yi-Ling Tsai Yu Ting Chang Wu, A.T.
Copyright Year	2015
Description	Author affiliation: Dept. of Chem. & Mater. Eng., Nat. Central Univ., Jhongli, Taiwan (Chun-Hao Huang; Yi-Ling Tsai; Wu, A.T.) \|\| Taiwan Uyemura Ltd. Co., Taoyuan, Taiwan (Yu Ting Chang)
Abstract	This paper investigates massive spalling that occurs in the intermetallic compounds at the interfaces between Pb-free SAC 305 and Co-based surface finishes. The SAC 305 solders were reflowed on the Co-based substrates and aged at different conditions. The samples were cross-sectioned to study the interfacial morphology. The occurrence of massive spalling depends on the constituents of the substrates. Shear tests were performed on the samples to evaluate the influence of massive spalling on the mechanical strength of the joints. The results indicated that massive spalling did not deteriorate the joint strength.
Sponsorship	Japan Inst. Electron. Packag.
Starting Page	586
Ending Page	589
File Size	1181271
Page Count	4
File Format	PDF
e-ISBN	9784904090138
DOI	10.1109/ICEP-IAAC.2015.7111082
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-04-14
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	The Japan Institute of Electronics Packaging
Subject Keyword	Massive spalling Gold Surface finish Shear strenrth Surface morphology Aging Surface finishing Soldering Joints Cobalt Substrates
Content Type	Text
Resource Type	Article

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Massive spalling in Pb-free solder on co-based surface finishes