NDLI: Improved low temperature gold-gold bonding using nanoporous powder bump using vacuum ultraviolet irradiation pre-treatment

Content Provider	IEEE Xplore Digital Library
Author	Kaneda, T. Mizuno, J. Okada, A. Matsunaga, K. Shoji, S. Saito, M. Nishikawa, H.
Copyright Year	2015
Description	Author affiliation: Grad. Sch. of Eng., Osaka Univ., Suita, Japan (Matsunaga, K.) \|\| Waseda Univ., Tokyo, Japan (Kaneda, T.; Mizuno, J.; Okada, A.; Shoji, S.; Saito, M.) \|\| Joining & Welding Res. Inst., Osaka Univ., Ibaraki, Japan (Nishikawa, H.)
Abstract	This paper describes a novel low temperature Au-Au bonding method using nanoporous Au-Ag powder and vacuum ultraviolet irradiation in the presence of oxygen gas $(VUV/O_{3})$ pre-treatment. The nanoporous powder, which was fabricated by dealloying Ag-Au alloy sheet, was used to form the bump structure on the Au substrate by simple filing process, while an Au-coated Si substrate was used as the chip. The $VUV/O_{3}$ treated bumps and chip was bonded under a bonding pressure of 20 MPa at 200 °C for 20 min in a vacuum atmosphere of 1 kPa. A ligament size of the nanoporous structure on powder surface was found to be grown dramatically during bonding process. The tensile strength reached 10.1 MPa which is 2.3 times higher than that without $VUV/O_{3}$ treatment. This suggests that organic contaminants on the each ligament surface were effectively removed by $VUV/O_{3}$ treatment, and consequently, the diffusion of gold atoms in the nanoporous powder was significantly promoted to change into bulk structure. The proposed method will be highly a promising method for 3D-LSI and MEMS packaging.
Sponsorship	Japan Inst. Electron. Packag.
Starting Page	473
Ending Page	477
File Size	949287
Page Count	5
File Format	PDF
e-ISBN	9784904090138
DOI	10.1109/ICEP-IAAC.2015.7111061
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-04-14
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	The Japan Institute of Electronics Packaging
Subject Keyword	Flip chip bonding Gold Powders Nanoporous powder Low temperature bonding VUV/O3 treatment Nanostructures Bonding Surface treatment Substrates
Content Type	Text
Resource Type	Article

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