NDLI: Variations of temperature sensitivity measurements of several packages under different environments

Content Provider	IEEE Xplore Digital Library
Author	Hara, T. Badalawa, W. Yafei Luo
Copyright Year	2015
Description	Author affiliation: Mentor Graphics Japan, Tokyo, Japan (Hara, T.; Badalawa, W.; Yafei Luo)
Abstract	Temperature sensitivity is used to measure the junction temperature of semiconductor devices without using external temperature sensors. Temperature sensitivity may vary more than 10% due to the measurement environments, which affects the accuracy of the junction temperature. However, this fact hasn't been well recognized. It is presumed that temperature sensitivity measurement is not reliable when a single sided cold plate is used. It is due to the temperature gradient between the cold plate and the ambient, through the junction of the semiconductor. Unless the device is put inside the temperature controlled chamber, it is hard to eliminate the temperature gradient between the junction of the semiconductor and the ambient. This paper presents the results of several temperature sensitivity measurements using 2 types of temperature controlled environments: a single sided cold plate and a temperature controlled chamber. Also, we have tested with several packages such as TO-220, TO-264, SOT-227, and D3 package, to see how it varies. We have come to the conclusion that it is better to use a temperature controlled chamber to measure temperature sensitivity, while some devices allow us to use a single sided cold plate as well. The differences due to the devices and environments are discussed by using CFD simulation, visualizing the temperature gradient inside the packages.
Sponsorship	Japan Inst. Electron. Packag.
Starting Page	390
Ending Page	394
File Size	733185
Page Count	5
File Format	PDF
e-ISBN	9784904090138
DOI	10.1109/ICEP-IAAC.2015.7111042
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-04-14
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	The Japan Institute of Electronics Packaging
Subject Keyword	Temperature measurement Temperature sensors CFD simulation Semiconductor device measurement Thermal Sensitivity Thermal Transient Test Cold plates Calibration Structure Function Junctions Thermal Analysis
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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