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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | JongTae Hwang WonJoo Jung SoYoung Kim |
| Copyright Year | 2015 |
| Description | Author affiliation: Coll. of Inf. & Commun. Eng., Sungkyunkwan Univ., Suwon, South Korea (JongTae Hwang; WonJoo Jung; SoYoung Kim) |
| Abstract | As portable electronic devices are widely used in wireless communication, analysis of RF interference becomes an essential step for IC designers. In order to test electromagnetic compatibility (EMC) of IC operating at high frequencies, IC stripline method is proposed in IEC standard. This method can be applied up to 3 GHz and covers the testing of ICs and small component. This paper represents simulation results of the open version of IC stripline in 3D EM solver. Also, the coupling effect of IC stripline method is analyzed with S-parameter results. The distributed lumped-element equivalent model is presented for explaining coupling relation between IC stripline and package. This model can be used for quick analysis for EMC of ICs. |
| Starting Page | 650 |
| Ending Page | 653 |
| File Size | 937295 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479966684 |
| e-ISBN | 9781479966707 |
| DOI | 10.1109/APEMC.2015.7175299 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-05-26 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Couplings IC stripline Three-dimensional displays Electromagnetic compatibility (EMC) Stripline 3D EM simulation Electromagnetic compatibility Circuit model Integrated circuit modeling Equivalent circuits |
| Content Type | Text |
| Resource Type | Article |
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