NDLI: Design and testing of the World's first single-level press-pack IGBT based submodule for MMC VSC HVDC applications

Content Provider	IEEE Xplore Digital Library
Author	Huifeng Chen Wenping Cao Bordignon, P. Rong Yi Haitao Zhang Wei Shi
Copyright Year	2015
Description	Author affiliation: Sch. of EEECS, Queen's Univ. Belfast, Belfast, UK (Huifeng Chen; Wenping Cao) \|\| Rongxin Power Electron., Beijing, China (Bordignon, P.; Rong Yi; Haitao Zhang; Wei Shi)
Abstract	The Modular Multilevel Converter (MMC) based VSC HVDC is an increasingly popular technology worldwide for both engineering installation and academic research purposes over the years. A submodule serves as the basic unit for the MMC, and the typical topology of a submodule is a half bridge configuration. Normally, controllable power devices are used for switches in a submodule, and plastic module IGBT and diodes (PMIs) are common choices. However, PMIs have a relatively short lifetime, since they are prone to bonding wire failure and solder layer fatigue as a result of power and thermal cycling. Another disadvantage of PMIs is their open-circuit failure mode. Thus, it's challenging for PMI based MMC HVDC to meet lifetime and long-term reliability requirements. On the other hand, press-pack IGBT/IEGT (PPI) can offer a much longer lifetime than PMIs, they have the unique short-circuit failure mode (SCFM), and they can carry higher currents. This is due to their special package design, which features double-side cooling and the removal of bonding wire and solder layer. Hence, PPIs are prefect devices for MMC HVDC, especially when power ratings are very high for future systems. The ±160kV/200MW MMC HVDC station is the largest one in the Nan'ao multi-terminal HVDC system, and it's also the world's first MMC HVDC that is based on single-level PPI devices for submodules. It is hoped that this paper provides insight into the design, analysis and testing process of its innovative submodule.
Starting Page	3359
Ending Page	3366
File Size	1358476
Page Count	8
File Format	PDF
e-ISBN	9781467371513
DOI	10.1109/ECCE.2015.7310134
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-09-20
Publisher Place	Canada
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Insulated gate bipolar transistors Thyristors MMC HVDC transmission VSC HVDC Capacitors PPI Offshore Renewable Energy Submodule Design Press-Pack IGBT / IEGT Heating Integrated circuit modeling Bars
Content Type	Text
Resource Type	Article

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