NDLI: Numerical study of a liquid metal heat spreader for power semiconductor devices

Content Provider	IEEE Xplore Digital Library
Author	Tawk, M. Avenas, Y. Vagnon, E. Msaed, A.
Copyright Year	2012
Description	Author affiliation: Laboratory of Applied Physics, Lebanese university, faculty of sciences II, Fanar - Lebanon (Msaed, A.) \|\| UMR CNRS 5269 - Grenoble INP - UJF, Grenoble Universities, France (Avenas, Y.; Vagnon, E.) \|\| Grenoble Electrical Engineering Laboratory (G2Elab), Grenoble Universities, France (Tawk, M.)
Abstract	This paper describes a new thermal management approach for cooling of power semiconductor devices. This new approach is based on a liquid metal fluid flow in order to spread the heat and evacuate it to the ambient. The work presented in this paper is considered as a first step to design and realize a liquid metal heat spreader (LMHS) for power electronics devices. In the first part of the paper, the geometry of a LMHS is described. In the second part, a fully multiphysics numerical study is presented. In order to demonstrate the advantage of the liquid metal heat spreader, a thermal performances comparison with a copper spreader (having the same external dimensions) is presented in the last part of this paper. First results show that the thermal resistance of the system could by reduced by about 40% using this new cooling solution.
Starting Page	85
Ending Page	90
File Size	761832
Page Count	6
File Format	PDF
ISBN	9781467308021
e-ISBN	9781467308038
e-ISBN	9781467308014
DOI	10.1109/ECCE.2012.6342838
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-09-15
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fluids Cooling Heating Magnetic liquids Copper Heat transfer
Content Type	Text
Resource Type	Article

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