NDLI: DBC substrates as a base for power MCM's

Content Provider	IEEE Xplore Digital Library
Author	Schulz-Harder, J.
Copyright Year	2000
Description	Author affiliation: Curamik Electron. Gmbh, Eschenbach, Germany (Schulz-Harder, J.)
Abstract	Multichip modules (MCM) for high current applications are needed for applications such as power amplifiers, inverters and DC-DC converters. The use of traditional thin and thick film hybrid substrates for high current applications is limited due to thin metallization layers and relatively high electric resistance of the conductors. Using DBC (direct bond copper) technology, thick copper foils (0.125-0.7 mm) are clad to alumina or aluminum nitride. Cu patterning is done by technology similar to that for PCB processing. The thick Cu conductors provide excellent current carrying capability and heat spreading of attached power dice. The strong adhesion of the Cu-to-ceramic bond reduces the thermal expansion coefficient in the plane to values only slightly higher than those of the ceramic itself (7.2-7.6/spl times/10/sup -6/). This allows direct die attach of large dice without TEC control layers. As DBC technology uses Cu foils, integrated lead-offs can be realized. This technology was developed by Curamik/sup (R)/ Electronics and is now in volume production. A new via technology combined with integrated leads allow the design of low weight hermetic packages with improved thermal performance. As the via resistance is <10/sup -4/ /spl Omega/, there is practically no current limitation in comparison to glass sealed feedthroughs of conventional hermetic metal packages. High end MCMs with extremely low thermal resistance (<0.03 K/W) can be achieved by integration of 3D micro channels for liquid cooling beneath the power circuit area. This is also a potential future solution for high speed microprocessor systems.
Starting Page	315
Ending Page	320
File Size	962776
Page Count	6
File Format	PDF
ISBN	0780366441
DOI	10.1109/EPTC.2000.906393
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-12-07
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper Electronic packaging thermal management Substrates Bonding Thermal resistance Multichip modules High power amplifiers Inverters DC-DC power converters Thick films
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Joint Reliability of Double-Side Packaged SiC Power Devices to a DBC Substrate with High Temperature Solders

Recent developments of direct bonded copper (DBC) substrates for power modules

A comparison of power module transistor stacks

A new packaging technique for power multichip modules

High performance cooling system for automotive inverters

A fabrication of DC-DC converter using LTCC NiZnCu ferrite thick films

Thermal management of a high-performance multichip module

A 50 kW IGBT power module for automotive applications with extremely low DC-link inductance

A novel integrated packaging technique for high density DC-DC converters providing enhanced efficiency and thermal management

DBC substrates as a base for power MCM's

Similar Documents

Joint Reliability of Double-Side Packaged SiC Power Devices to a DBC Substrate with High Temperature Solders

Recent developments of direct bonded copper (DBC) substrates for power modules

A comparison of power module transistor stacks

A new packaging technique for power multichip modules

High performance cooling system for automotive inverters

A fabrication of DC-DC converter using LTCC NiZnCu ferrite thick films

Thermal management of a high-performance multichip module

A 50 kW IGBT power module for automotive applications with extremely low DC-link inductance

A novel integrated packaging technique for high density DC-DC converters providing enhanced efficiency and thermal management

DBC substrates as a base for power MCM's