NDLI: Microsystems for medical applications

Content Provider	IEEE Xplore Digital Library
Author	Val, A. Esteve, D. Val, C.
Copyright Year	1996
Description	Author affiliation: Lab. d'Autom. et d'Anal. des Syst., CNRS, Toulouse, France (Val, A.)
Abstract	The different 3D interconnection techniques have been initially applied to memories for a couple of main reasons market and easiness. With the development of a 3D technique from 1988, first at THOMSON-CSF and after at 3D PLUS, other criteria have been taken in account: stacking of the heterogeneous components, civilian applications which could be ruggedized later, and very low cost compatible with communication, automotive and medical applications. To allow this, each of the six operations of the flow chart are derived from large scale manufacturing in connected domains: devices are mounted into foils, taken from the smart cards manufacturing "Reel to Reel process" developed by GEMPLUS, same plastic moulding than the encapsulation technique of dice into plastic packages, plating identical to the metallized holes process in the printed circuit board industry, and laser etching by the mean of a YAG marking laser.
Starting Page	408
Ending Page	415
File Size	1450874
Page Count	8
File Format	PDF
ISBN	0780336429
ISSN	10898190
DOI	10.1109/IEMT.1996.559776
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-10-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Medical services Biomedical equipment Manufacturing processes Plastics Integrated circuit interconnections Stacking Costs Automotive engineering Flowcharts Large-scale systems
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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