NDLI: A thin and low thermal resistance aluminum nitride BGA package for high speed DSP devices

Content Provider	IEEE Xplore Digital Library
Author	Iwase, N. Yasumoto, T. Asai, H. Monma, J. Yano, K. Hayashida, H.
Copyright Year	1996
Description	Author affiliation: Toshiba Corp., Yokohama, Japan (Iwase, N.)
Abstract	Low thermal resistance and high TCT (temperature cycle test) reliability have been attained by thin AlN BGA package structure. High speed signal transmission for multimedia DSP (digital signal processor) has been analyzed by computer simulation. The package has 0.6 mm body thickness, which is 1/3 of ordinary ceramic packages. A low thermal resistance of 4.8 /spl deg/C/W has been attained without a heat sink and with no air cooling while mounted on a PWB having 4 conductive layers. Scattering parameters were measured up to 9 GHz and applied to 250 MHz clock signal simulation. No deterioration of signal waveforms was observed during the simulation. The effects of package thickness and package size have been discussed from the thermal resistance and TCT reliability point of view. Thicker and larger package size provided lower thermal resistance. The developed package thickness and size (35/spl times/35 mm) have been determined by taking into account the application field of mobile PCs (personal computers) and through simulation. The package thickness versus TCT reliability has been discussed, and then the TCT has been carried out under an assembled condition on a PWB, and MTTF of 1 k cycles has been derived.
Starting Page	99
Ending Page	103
File Size	945647
Page Count	5
File Format	PDF
ISBN	0780336429
ISSN	10898190
DOI	10.1109/IEMT.1996.559694
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-10-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal resistance Aluminum nitride Packaging Immune system Computer simulation Temperature Testing Signal processing Digital signal processing Digital signal processors
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
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7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
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