NDLI: Thermomechanical behavior of ceramic ball grid array based on experiments and FEM simulations

Content Provider	IEEE Xplore Digital Library
Author	Deletage, J.-Y. Fenech, A. Bechou, L. Ousten, Y. Danto, Y. Salagoity, M. Faure, C. Rao, S.
Copyright Year	1996
Description	Author affiliation: Bordeaux I Univ., Talence, France (Deletage, J.-Y.)
Abstract	In this paper, we have performed 2D finite element simulations on CBGA components assembled on FR4 card in order to evaluate the highest stressed regions of the solder joint. The maximum cumulative strain energy has been calculated as a function of the thermal cycling characteristics and of the package size to evaluate the fatigue of the solder joints. Accelerated ageing tests (0/spl deg/C to 100/spl deg/C) have been performed on CBGA samples to validate such a global approach. The analysis of the degradation have been performed using direct observation with SEM and also a specific procedure of acoustic imaging allowing the detection of defects located on the inner balls. From the previous FEM simulation results and the experimental data under thermal cycling, we propose a global interpretation, based on general mechanical laws, of the thermomechanical behavior of the CBGA solder joints under thermal cycling. Conclusions about the evolution of the CBGA assemblies criticity with both package size and ball number increase are deduced from this study.
Starting Page	91
Ending Page	98
File Size	1033766
Page Count	8
File Format	PDF
ISBN	0780336429
ISSN	10898190
DOI	10.1109/IEMT.1996.559692
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-10-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermomechanical processes Ceramics Electronics packaging Soldering Performance evaluation Assembly Finite element methods Capacitive sensors Fatigue Accelerated aging
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Reliability Comparison of Two Metallurgies for Ceramic Ball Grid Array

Thermomechanical multi-domain stress modeling for fatigue analysis of electronic packaging

Thermo-mechanical fatigue reliability of Pb-free ceramic ball grid arrays: experimental data and lifetime prediction modeling

Grain growth in eutectic Pb/Sn ball grid array solder joints

Finite element based solder joint fatigue life predictions for a same die size-stacked-chip scale-ball grid array package

Reliability comparison of two metallurgies for ceramic ball grid array

Effects of Ceramic Ball-Grid-Array Package's Manufacturing Variations on Solder Joint Reliability

Vibration Testing and Analysis of Ball Grid Array Package Solder Joints

FEM analysis with cyclic visco-plasticity for solder bumped flip-chip packaging

Thermomechanical behavior of ceramic ball grid array based on experiments and FEM simulations

Similar Documents

Reliability Comparison of Two Metallurgies for Ceramic Ball Grid Array

Thermomechanical multi-domain stress modeling for fatigue analysis of electronic packaging

Thermo-mechanical fatigue reliability of Pb-free ceramic ball grid arrays: experimental data and lifetime prediction modeling

Grain growth in eutectic Pb/Sn ball grid array solder joints

Finite element based solder joint fatigue life predictions for a same die size-stacked-chip scale-ball grid array package

Reliability comparison of two metallurgies for ceramic ball grid array

Effects of Ceramic Ball-Grid-Array Package's Manufacturing Variations on Solder Joint Reliability

Vibration Testing and Analysis of Ball Grid Array Package Solder Joints

FEM analysis with cyclic visco-plasticity for solder bumped flip-chip packaging

Thermomechanical behavior of ceramic ball grid array based on experiments and FEM simulations