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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yu, A.M. Chang-Woo Lee Jeong-Han Kim Mok-Soon Kim Jong-Hyun Lee |
| Copyright Year | 2007 |
| Description | Author affiliation: Microjoininh Center, KITECH, Incheon (Yu, A.M.; Chang-Woo Lee; Jeong-Han Kim) |
| Abstract | This study investigated the reaction and mechanical properties of a In added quaternary composition solder alloy having low Ag content, i.e. Sn-xAg-0.5Cu-yIn to replace the Sn-3.0Ag-0.5Cu composition used widely as a representative Pb-free solder alloy. We found that the In addition of small amount did significantly improve a wettability of the solder at the reflow temperature of 230~240degC. Moreover, the addition did also improve outstandingly the elongation of the solder alloy, thereby increasing the toughness of the alloy. With these results, it was found that if the added amount of In and Ag are optimized, the Sn-Ag-Cu-In quaternary alloy will be a strong candidate for the replacement of Sn-3.0Ag-0.5Cu composition. |
| Starting Page | 1 |
| Ending Page | 4 |
| File Size | 4708460 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424419098 |
| DOI | 10.1109/EMAP.2007.4510328 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-11-19 |
| Publisher Place | South Korea |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Mechanical factors Testing Soldering Chip scale packaging Materials science and technology Force measurement Temperature measurement Semiconductor device modeling Temperature distribution Alloying |
| Content Type | Text |
| Resource Type | Article |
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