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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lau, J. Lo, J. Lam, J. Eng-Leong Soon Woai Sheng Chow Lee, R. |
| Copyright Year | 2007 |
| Description | Author affiliation: Inst. of Microelectron., Singapore (Lau, J.) |
| Abstract | The effects of aging and underfills on the drop test of lead- free (SnAgCu or SAC) PBGA packages on ImAg (immersion silver) PCB are investigated. Two different underfills are studied. These underfills are dispensed on the PCB to fill the gaps between the BT (bismaleimide triazene) substrate of the PBGA, the Sn3wt%Ag0.5wt%Cu solder balls and paste and the PCB. In addition, two more sets of samples (without underfull) are tested (one is with SAC solder balls and paste and the other is with Sn37wt%Pb solder balls and paste), which serve as controls. The sample size for each of the 4 different sets of samples is 24 and half of them (12) are subjected to temperature aging (125degC for 500 hours). The test condition is based on JESD-B 111 (the acceleration = 2900G and the impact duration = 0.3ms). A strain gauge is used to measure the deformation of the test board during impacts. The true characteristic life, true mean time to failure (MTTF), and true Weibull slope of the PBGA interconnects under certain confidence requirements have also been determined. Failure analysis has been performed and examined on some of the failed samples. The results presented in this study should be useful for understanding the effects of aging and underfills on the lead-free PBGA interconnect reliability under drop conditions. |
| Starting Page | 1 |
| Ending Page | 8 |
| File Size | 12317185 |
| Page Count | 8 |
| File Format | |
| ISBN | 9781424419098 |
| DOI | 10.1109/EMAP.2007.4510284 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-11-19 |
| Publisher Place | South Korea |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Circuit testing Aging Electronics packaging Plastic packaging Printed circuits Environmentally friendly manufacturing techniques Lead Strain measurement Integrated circuit interconnections Silver |
| Content Type | Text |
| Resource Type | Article |
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