NDLI: CALCE research opportunities at the University of Maryland

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Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium

12th International Electronic Manufacturing Technology Symposium

8th IEEE/CHMT International Conference on Electronic Manufacturing Technology Symposium

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,

Reducing the cost and effort of computer-aided test program development

Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium. Proceedings 1989 (Cat. No.89CH2720-1)

Computer integrated manufacturing (semiconductor processing)

Achieving semiconductor equipment reliability

Managing manufacturing performance

Total productive maintenance; TPM that works

Applications of artificial intelligence in factory management

Dynamic behavior of SMT chip capacitors during solder reflow

Solderability test requirements for plastic surface mount packages

Plastic package moisture absorption hazards in SMT board assembly

The reliability of reflow soldering by hot air reflow

Solder joint reliability of fine pitch surface mount technology assemblies

Analyzing the mechanical strength of SMT attached solder joints

In-line statistical process control and feedback for VLSI integrated circuit manufacturing

An expert system for real-time process characterization and control (photolithography)

Improving exposure system's compatibility by changing the lamp calibration method

A real time data acquisition and monitor system for integrated circuit visual inspection

A successful strategy for implementing statistical process controls

SPC implementation and real time results

Fabrication of high density multichip modules

Optimizing the cost of the telecommunication system

Fluoropolymer composite multichip modules

Recent developments in silicon hybrid multi-chip modules

High performance controlled impedance interconnection system

Heat seal connectors: a new high density SMT interconnection system

Using process dissection to achieve design for manufacturability for electronic assemblies

A study of the roles of consultants in facilitating theassembly manufacturing flow among segments of the US semiconductor and electronics industries

Electronic system packaging: the search for manufacturing the optimum in a sea of constraints

University/industry (and government) interdisciplinary centers, programs, consortia, inter-relations, and initiatives

Center for Integrated Manufacturing Decision Systems: an overview

The University of Illinois Manufacturing Research Center

Technology transfer-a future imperative

CALCE research opportunities at the University of Maryland

The Leaders for Manufacturing Program: a new type of industry/university consortium

Teaching, research and service in manufacturing at NJIT

IMSEI: a graduate education, research, and technology transfer program in integrated manufacturing systems supported by a university/industry consortium

Academia linking with industry-the RPI model

Mass production back-grinding/wafer-thinning technology for GaAs devices

A process for prevention of low temperature oxide growth over gold coated backside of silicon wafer

Low stress silver-glass die attach material

LED array modules by new method micron bump bonding method

TAB implementation: a military user's viewpoint

Cantilever beam micro-contacts in a multi-chip interconnection system

Electron beam direct writing technology for printed wiring board

Evolution of integrated manufacturing in the 1980s

Vacuum mechatronics and self-contained manufacturing for microelectronics processing

Using coarse/fine manipulation with vision to place fine pitch SMD components

Knowledge based control of adhesive dispensing for surface mount device assembly

Maglev microrobotics: an approach toward highly integrated small-scale manufacturing systems

Analysis of an advanced manufacturing cell through computer simulation

Job disposition cost model

A multilayer surface mount technology elevated by an aramid-paper and epoxy-resin composite

Kinetic interactions of copper, lead and tin on solder coated PC boards studied using X-ray diffraction

Improving circuit speed through resin chemistry (a polycyanate resin for high speed PWB applications)

Dielectric studies of solder paste fluxes and applications to no-clean paste formulations

Effect of heat and moisture on thick positive photoresist

Effects of material and process on the reliability of very small hermetic microwave packages

Nondestructive evaluation of debonding within plastic integrated circuit packages using different methods of acoustic microscopy

Computer integrated inspection system for aluminum nitride substrate manufacturing

Nondestructive evaluation of TAB bonds by acoustic microscopy

A CAD coupled laser beam test system for digital circuit failure analysis

Preparation of custom gate array silicon wafers to handle specific wafer size in metallization process

Is design realization a process? A case study

Enhanced high speed performance from HDI thin film multi-chip modules

Enhanced high speed performance from HDI thin film multichip modules

Engineering research centers: the Purdue experience

PC based image analyser for mask inspection

Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium

Ninth IEEE/CHMT International Symposium on Electronic Manufacturing Technology,Competitive Manufacturing for the Next Decade

Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium

CALCE research opportunities at the University of Maryland

Content Provider	IEEE Xplore Digital Library
Author	Pecht, M.G. Barker, D.B. Weiss, D.
Copyright Year	1989
Description	Author affiliation: Coll. of Eng., Maryland Univ., College Park, MD, USA (Pecht, M.G.; Barker, D.B.; Weiss, D.)
Abstract	The University of Maryland has initiated an integrated program in computer-aided life cycle engineering (CALCE) to assist the nation's industries in competitively meeting the foreign challenge both economically and technically. To meet current needs in electronic design, the University of Maryland established an Industry/University Cooperative Research Center whose research theme is to promote basic study in the application of advanced technologies to the engineering design of electronic equipment. The CALCE effort places special emphasis on development and optimization of those design techniques which lend themselves to intelligent manufacturing, reliability, and maintainability; multiparameter optimization, evaluation of materials, and structures in unique environments; and advanced modeling, simulation, and prediction for industrial applications. The history of this CALCE effort is reviewed, and the CALCE Center organization, facilities, and research are described.<>
Starting Page	182
Ending Page	185
File Size	488911
Page Count	4
File Format	PDF
DOI	10.1109/EMTS.1989.68972
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1989-09-25
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Manufacturing industries Design optimization Predictive models Computer industry Industrial economics Economic forecasting Environmental economics Industrial electronics Electronics industry Application software
Content Type	Text
Resource Type	Article

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