NDLI: Recent developments in silicon hybrid multi-chip modules

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Recent developments in silicon hybrid multi-chip modules

Content Provider	IEEE Xplore Digital Library
Author	Corless, A.R.
Copyright Year	1989
Description	Author affiliation: Thorn EMI, Hayes, UK (Corless, A.R.)
Abstract	The author describes the Research Initiative Silicon Hybrids (RISH) programme, established in September, 1986, to investigate all aspects of silicon in multichip module applications. A series of test vehicles has been fabricated to demonstrate the merits for real circuit applications. The author summarizes the merits of silicon as a multichip module substrate and considers, in detail, the specific application of an active substrate multichip module in which some of the circuitry is fabricated within the substrate. Within the programme extensive use has been made of flip-chip technology. The close expansion match between a silicon substrate and a silicon chip would be expected to lead to very good reliability when a flip-chip process is used. Initial results confirm these expectations.<>
Starting Page	111
Ending Page	117
File Size	632200
Page Count	7
File Format	PDF
DOI	10.1109/EMTS.1989.68962
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1989-09-25
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Very large scale integration Thermal conductivity Thermal expansion Thermal management Packaging Fabrication Research initiatives Circuit testing Aerospace industry
Content Type	Text
Resource Type	Article

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