Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kuramochi, S. Koiwa, S. Suzuki, K. Fukuoka, Y. |
| Copyright Year | 2014 |
| Description | Author affiliation: Dai Nippon Printing Co., Ltd., Kashiwa, Japan (Kuramochi, S.; Koiwa, S.; Suzuki, K.) |
| Abstract | As electronic product becomes smaller and lighter with an increasing number of function← the demand for high density and high integration becomes stronger.! Interposers for system in package will became more and more important for advanced electronic systems. Silicon interposers with through silicon vias (TSV) and back end of line (BEOL) wirring offer compelling benefits for 2.5D and 3D system integration;! however, they are limited by high cost and high electrical loss. On the other hand, glass has many properties that make it an ideal substrate for interposer substrates such as; ultra high resistivity, adjustable thermal expansion (CTE) and manufacturability with large panel size. Furthermore, glass via formation capabilities have dramatically improved over the past several months. Fully populated wafers with > 100,000 through holes (50μm diameter) are fabricated today with 300pm thick glass. This paper presents the demonstration of glass interposers with fine pitch through glass vias(TGV), ! with 6um RDL lithography. TGVs of 50μm in diameter and 200μm in pitch were formed successfully on 300μm thick alkali-free glass by Focused Electrical Discharging Method (FEDM). The TGVs were filled with solid Copper (Cu) using a void-free electroplating of optimized periodic pulse reverse(PPR) process and chemical mechanical polishing (CMP) as well as the TSVs. Highly insulating TGV with double side polymer insulation resulted in TGV with an insertion loss of less than 0.23dB at 20GHz. Excellent through via reliability was demonstrated, due to double side thick polymer insulator that buffers the stress created by CTE mismatch between glass, copper vias and copper traces, and TGV at 200μm pitch passed 1000 thermal cycles from -40Cdeg to 85Cdeg. |
| Starting Page | 1673 |
| Ending Page | 1678 |
| File Size | 2278811 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781479924073 |
| DOI | 10.1109/ECTC.2014.6897521 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-05-27 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Glass Silicon Copper Substrates Resistance Arrays Polymers |
| Content Type | Text |
| Resource Type | Article |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|