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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lang, B. Pinamaneni, S. |
| Copyright Year | 1988 |
| Description | Author affiliation: Nat. Semicond. Corp., Santa Clara, CA, USA (Lang, B.; Pinamaneni, S.) |
| Abstract | The consistency and quality of Au wire thermosonically wedge-bonded to copper-alloy leadframes plated with pure copper is investigated, and its bondability is compared to that of the Au/Ag and Au/Au bonds. The considerations required to achieve successful bonds are also described. Special emphasis is given to the importance of the surface finish of the Cu-plated leadframes, and the die-attach and wire-bonding conditions required in order to make a highly reliable and cost-effective package. Results of the reliability tests of the packages assembled using Au-wire-to-Cu plated leadframes are discussed and compared with the package reliability results for the standard Au/Ag and Au/Au bonding processes.< |
| Starting Page | 546 |
| Ending Page | 551 |
| File Size | 518114 |
| Page Count | 6 |
| File Format | |
| DOI | 10.1109/ECC.1988.12646 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1988-05-09 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Bonding Copper Gold Wire Lead compounds Assembly Semiconductor device packaging Manufacturing processes Costs Plastics |
| Content Type | Text |
| Resource Type | Article |
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