NDLI: Flexible PCB grounding connections for hybrid systems

Content Provider	IEEE Xplore Digital Library
Author	Cracraft, M. Connor, S. Archambeault, B.
Copyright Year	2013
Description	Author affiliation: Syst. & Technol. Group, IBM, Research Triangle Park, NC, USA (Connor, S.; Archambeault, B.) \|\| Syst. & Technol. Group, IBM, Poughkeepsie, NY, USA (Cracraft, M.)
Abstract	The connection of the logic ground to the chassis can influence a number of EMC factors such as emissions, RF immunity, and ESD immunity. Improper connections can turn the chassis into an unintended radiator. Historically, two different grounding strategies have been used. Printed circuit boards are either connected in many locations through low impedance paths, or a single point connection is used with any other connections using high-impedances. Both have been applied successfully in the past, but mixing the two could have unintended consequences. In order to adapt to such environments a designer may desire some flexibility, such as the ability to open or short a particular ground connection without major PCB changes. This paper discusses utilizing components such as 0-ohm resistors in place of direct short connections between logic ground and the chassis. The additional parasitic inductance incurred is quantified relative to direct connections for a number of configurations.
Starting Page	466
Ending Page	471
File Size	354039
Page Count	6
File Format	PDF
ISBN	9781479904082
ISSN	21581118
e-ISBN	9781479904105
DOI	10.1109/ISEMC.2013.6670458
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-08-05
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Inductance Grounding Electromagnetic compatibility Impedance Capacitors Geometry Electrostatic discharges
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electrical and Electronic Engineering

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