NDLI: Radiated Emissions from Proximity Coupled Oversized Heat-Sinks

Content Provider	IEEE Xplore Digital Library
Author	Moongilan, D.
Copyright Year	2007
Description	Author affiliation: Alcatel-Lucent, Holmdel (Moongilan, D.)
Abstract	Radiated emission characteristics of oversized heat sinks that have surface area substantially larger than the top contact surface of the IC package are investigated. The oversized heat sinks are found to radiate higher levels at the frequencies that are present in components and traces in the proximity of the heat sink than the frequencies contained within the IC package itself. In this paper, oversized heat sinks are modeled as proximity coupled patch antennas with a short-circuited stub. Patch antenna characteristics such as input impedance (that varies with the feed positions) and resonance frequencies are applied in analyzing the radiated emissions characteristics of oversized heat sinks. Radiated emissions measured from a physical proximity coupled patch antenna model and a highly integrated PCB with oversized heat sink is presented and results discussed. An oversized heat sink is defined as heat sink mounted to the top IC package that has a planar area substantially (> 2 times) larger than the contact area of the IC package.
Starting Page	1
Ending Page	6
File Size	737476
Page Count	6
File Format	PDF
ISBN	1424413494
DOI	10.1109/ISEMC.2007.116
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-07-09
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heat sinks Integrated circuit packaging Patch antennas Space heating Resonant frequency Radio frequency Contacts Dielectrics Antenna measurements Radiofrequency integrated circuits
Content Type	Text
Resource Type	Article

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