NDLI: Efficient performance evaluation of high-speed differential interconnect lines with via discontinuities

Content Provider	IEEE Xplore Digital Library
Author	Hyewon Kim Junghyun Lee Yungseon Eo
Copyright Year	2013
Description	Author affiliation: Dept. Electron. & Commun. Eng., Hanyang Univ., Ansan, South Korea (Hyewon Kim; Junghyun Lee; Yungseon Eo)
Abstract	Vias in transmission lines cause significant waveform distortion due to electromagnetic wave reflections and vias may behavior like a band rejection filter due to resonances in between reference planes. These undesirable effects significantly exacerbate the signal integrity in high-speed and high-frequency integrated circuits, packaged modules, or printed circuit board (PCB). In this work, discontinuous interconnect lines including vias are experimentally characterized with S-parameter measurements in the frequency range of 10 MHz to 40 GHz. Then base on the experimental characterizations, an accurate circuit model to represent electrical characteristics of the vias is developed. It is shown that with the proposed technique, the high-performance integrated system can be efficiently designed by avoiding the conventional strict layout design rules for the discontinuous lines.
Starting Page	207
Ending Page	210
File Size	613463
Page Count	4
File Format	PDF
ISBN	9781479907052
e-ISBN	9781479907076
DOI	10.1109/EPEPS.2013.6703500
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-10-27
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit modeling Transmission line measurements Frequency measurement RLC circuits Layout Integrated circuit interconnections Scattering parameters vias Circuit model resonance scattering parameters signal integrity
Content Type	Text
Resource Type	Article

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