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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Vassighi, A. Semenov, O. Sachdev, M. Keshavarzi, A. |
| Copyright Year | 2002 |
| Description | Author affiliation: Dept. of Electr. & Comput. Eng., Waterloo Univ., Ont., Canada (Vassighi, A.; Semenov, O.; Sachdev, M.) |
| Abstract | The leakage power is expected to increase with scaling of CMOS technology. The increased leakage is a strong function of the elevated temperature and voltage stress. As a consequence; under the burn-in (BI) conditions the elevated leakage power may cause increased post burn-in fallout. In this paper the impact of elevated leakage and technology scaling in burn-in environment on post BI yield is analyzed. We have also shown that to maintain a constant post-BI yield loss, the burn-in temperature should go down by 10/spl deg/C for each technology generation. We also show that at static burn-in conditions, the die temperature is increased exponentially and range of optimal stressed voltage and temperature for fixed post burn-in yield loss is reduced significantly, when CMOS technology is aggressively scaled down. |
| Starting Page | 12 |
| Ending Page | 19 |
| File Size | 1165691 |
| Page Count | 8 |
| File Format | |
| ISBN | 0769518311 |
| ISSN | 15505774 |
| DOI | 10.1109/DFTVS.2002.1173497 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2002-11-06 |
| Publisher Place | Canada |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Very large scale integration CMOS technology Voltage Bismuth Power dissipation Thermal resistance Stress Temperature distribution Circuit testing Immune system |
| Content Type | Text |
| Resource Type | Article |
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