NDLI: Nodal and Spatial Analysis for a Compact Thermal Modeling Methodology

Content Provider	IEEE Xplore Digital Library
Author	Krishnamoorthy, S. Chowdhury, M.H.
Copyright Year	2007
Description	Author affiliation: Univ. of Illinois, Chicago (Krishnamoorthy, S.; Chowdhury, M.H.)
Abstract	The efforts of integrated circuits technology scaling have been focused on achieving highest performance. However, aggressive scaling leads to a non-uniform temperature distribution across the 1C, which will directly impact its performance and reliability. This paper analyzes and discusses the impacts of spatial temperature distribution at the die-level. A lumped R-C thermal model consists of several nodes with heat dissipation modeled as current sources. A physical interpretation of nodes ensures the correspondence between structural and thermal models. The dependence of a node's conductive and capacitive parameters on the spatial domain is observed upon performing a node-level analysis. The temperature variations at finer granularities would be different from the overall temperature. This drive to investigate the variation of temperature in the spatial domain yields a relation between the size of the heat source and the peak temperature rise, and this analytical approach can be implemented in any thermal model. We deduce that, for heat sources with larger sizes (i.e. having lower spatial frequencies) the thermal impedance is higher than sources with small dimensions (higher spatial frequencies) whose impedance drops to smaller values due to the presence of AC component in thermal spatial capacitance. This explains the spatial temperature filtering effect.
Starting Page	139
Ending Page	144
File Size	1957541
Page Count	6
File Format	PDF
ISBN	9781424412273
DOI	10.1109/RTP.2007.4383833
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-10-02
Publisher Place	Italy
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature distribution Thermal resistance Power system reliability Resistance heating Thermal engineering Thermal management Electronic packaging thermal management Performance analysis Integrated circuit reliability Frequency
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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