NDLI: Interconnection failure caused by bath degradation in copper electroplating and its VM-FDC using mathematical model

Content Provider	IEEE Xplore Digital Library
Author	Imai, S.-I. Kitabata, M. Tanaka, T.
Copyright Year	2009
Description	Author affiliation: Panasonic Semiconductor Engineering Co., Ltd., 800 Higashiyama, Uozu City, Toyama, 937-8585 JAPAN (Kitabata, M.) \|\| Manufacturing Technology Center, Semiconductor Company, Panasonic Corporation, 800 Higashiyama, Uozu City, Toyama, 937-8585 JAPAN (Imai, S.-I.; Tanaka, T.)
Abstract	This paper describes a copper interconnection failure in a damascene process of a system on chip (SoC) caused by the plating bath degradation in copper electroplating equipment. By “semimetrics” using EES (Equipment Engineering System) data for many variables in the equipment and some statistical methods, it is clarified that the root cause of the interconnection failure is the plating bath degradation. The degradation means the increase of a by-product, whose existence is confirmed by analyzing the bath plating using HPLC (high performance liquid-chromatograph). Therefore, the degradation in the plating bath causes void formation in a via hole and causes interconnection failure. Moreover, a virtual metrology (VM) model for the bath plating degradation due to the by-product is developed using a mathematical model. VM-FDC (Fault detection and classification) using a mathematical model is performed and the interconnection failure is prevented.
Starting Page	254
Ending Page	258
File Size	567982
Page Count	5
File Format	PDF
ISBN	9781424436149
ISSN	10788743
DOI	10.1109/ASMC.2009.5155995
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-05-10
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Degradation Copper Mathematical model System-on-a-chip Data engineering Systems engineering and theory Statistical analysis Performance analysis Metrology Virtual manufacturing
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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